Manufacture method of thick copper plate fine solder resist bridge

Abstract

The invention discloses a manufacture method of a thick copper plate fine solder resist bridge. The manufacture method comprises the following steps of: baffling printing ink at the position of a fine solder resist bridge by a mesh plate with oil baffle points when first oil printing is carried out, wherein the thickness of the printing ink of a thick copper plate line can be guaranteed only by printing the printing ink at the other positions; and carrying out second printing by a normal blank mesh plate. After the method is used, under the condition that the thickness of the printing ink of the thick copper plate line is guaranteed, the thickness of the printing ink at the fine solder resist bridge is reduced, and the thickness condition of the manufactured fine solder resist bridge can be met; the conventional double-alignment, exposure and development technology is changed into one-time-alignment, exposure and development technology after the whole craft process is used; and the printing oil at the edge within an oil baffle region inwards leaks due to the liquidity of the printing ink after the first printing, so that the stepped drop can be avoided in the process of secondary silk screen, and the thick copper plate fine solder resist bridge is attractive in appearance. The stepped apparent defect caused by the double times of exposure and development can be avoided.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a method for manufacturing a fine solder-resisting bridge of a thick copper plate. Background technique [0002] In order to ensure the thickness of ink on the circuit when making solder resist on thick copper plate (≥2OZ), it is often made by two printings or multiple printings, but after printing, the ink will be thicker due to the position of the substrate (generally equivalent to the thickness of copper, that is, ≥ 70um), when making small green oil bridges, due to side erosion, the quality of the green oil bridges is often abnormal, which seriously troubles the industry to mass-produce such products. [0003] At present, for this type of board, circuit board manufacturers generally use two printings, two alignments, exposure and development: Method 1. Make the green oil bridge in the first printing and alignment exposure development, and the second alignment Open ...

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a method for manufacturing fine solder-resist bridges on thick copper plates, aiming to solve the problems of low efficiency in making fine green oil bridges, poor product appearance, and low yield rate

Images