Adhesion material cutting device of FPC (flexible printed circuit) board
A circuit board and cutting technology, which is applied in metal processing and other directions, can solve the problems of increased production cost and waste of circuit boards, and achieve the effect of reducing production cost, reducing waste and avoiding scrap strips.
Inactive Publication Date: 2013-07-17
深圳市升宇智能科技有限公司
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Problems solved by technology
[0002] At present, the processing in the field of circuit boards, especially the FPC flexible circuit board attachment materials, is formed by punching the strip-shaped FPC boards through stamping dies. Although the punched circuit boards have good dimensional stability, the punching FPC boards inevitably produce waste edge strips. Generally speaking, the waste materials are 30-40% of the entire FPC pasting materials, causing great waste and increasing the production cost of circuit boards.
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Embodiment Construction
[0013] Attached below figure 1 , 2 And embodiment, the present invention is further elaborated:
[0014] A cutting device for attaching materials to FPC circuit boards, the cutting device includes a vertically arranged frame 1, the frame 1 is provided with a through working chamber 11, and the middle part of the working chamber 11 is horizontally provided with a knife edge upward Lower cutting knife 21, a reciprocating drive device 3 is arranged on the top of the frame 1, and the bottom of the reciprocating driving device 3 drives the upper cutting knife 22 with the cutting edge downward, and the upper cutting knife 22 and the lower cutting knife 21 form a pair of cutting knife 2 .
[0015] As a preferred embodiment, the reciprocating drive device 3 drives a sliding frame 4 downward, and the sliding frame 4 is arranged on the frame 1 to slide up and down, and the sliding frame 4 is slidably arranged on the frame 1 through a pair of bearing guide rails 41 arranged left and ri...
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The invention relates to the technical field of circuit board processing equipment, particularly to an adhesion material cutting device of an FPC board. The adhesion material cutting device of the FPC board comprises a vertically-arranged machine frame, a working chamber is arranged on the machine frame in a penetrated mode, a reciprocating driving device is arranged at the top of the machine frame, an edge-downward upper cutter is arranged under the reciprocating driving device and driven by the reciprocating driving device, and the upper cutter and a lower cutter form a set of cutters. Before the adhesion material cutting device of the FPC board is used, strip materials can be fed into the adhesion material cutting device of the FPC board, and a certain length of the strip materials is fed between the upper cutter and the lower cutter each time; and the reciprocating driving device drives the upper cutter towards the lower cutter to cut out the certain length of the strip materials to form a circuit board with the required size. Therefore, edge-slitted strip materials generated through a traditional punching cutting mode can be avoided, waste of FPC adhesion materials can be reduced, and the production cost of circuit boards can be reduced.
Description
technical field [0001] The invention relates to the technical field of circuit board processing equipment, in particular to a cutting device for FPC circuit board attachment materials. Background technique [0002] At present, the processing in the field of circuit boards, especially the FPC flexible circuit board attachment materials, is formed by punching the strip-shaped FPC boards through stamping dies. Although the punched circuit boards have good dimensional stability, the punching The unavoidable generation of waste edge strips for FPC boards, generally speaking, waste materials are 30-40% of the entire FPC pasting materials, resulting in great waste and increased production costs of circuit boards. Contents of the invention [0003] The present invention aims to provide a cutting device for the FPC circuit board attachment material aiming at the deficiency existing in the current punching method of the FPC flexible circuit board attachment material. [0004] To ac...
Claims
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Inventor 张舞杰李迪叶峰赖乙宗
Owner 深圳市升宇智能科技有限公司