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A technology for a wafer stage and a chip is applied in the field of plasma technology to meet the requirements of maintaining vacuum degree, avoid process unevenness, and simplify the effect of uniform gas structure.
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[0029] In order to deeply understand the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0030] See attached figure 1 The slide table provided by the present invention includes a chamber 6 , a chamber upper cover 5 , electrodes 4 , a chip fixing plate 1 , a fixing plate support ring 3 and a support plate 7 , and an air outlet 9 is opened at the bottom of the chamber 6 . The chamber upper cover 5 is installed on the chamber 6 , and the chamber upper cover 5 is provided with an air inlet 8 , and the chamber upper cover 5 is attached with an electrode 4 at the lower part of the air inlet 8 . The support disc 7 is annular, and the center of the support disc 7 is provided with a first through hole 10 , and the support disc 7 is installed on the inner side wall of the chamber 6 . The support ring 3 of the fixed disc is installed on the support disc 7 , and the support ring 3 of the ...
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