Provided are a
polishing pad and a method of manufacturing a
semiconductor device using the same, the
polishing pad having a structure that maximizes a
water leakage prevention effect, including: a
polishing layer including a first surface and a second surface, and a first through-hole passing through the first surface to the second surface; a window disposed in the first through-hole; and a support layer disposed on the second surface side of the polishing layer, including a third surface and a fourth surface, and a second through-hole passing through the third surface to the fourth surface while being connected to the first through-hole, the second through-hole being smaller than the first through-hole, a lowermost end surface of the window being supported by the third surface, a first
adhesive layer being included between the lowermost end surface of the window and the third surface, a second
adhesive layer being included between the second surface and the third surface and between the lowermost end surface of the window and the third surface, a
barrier layer being included on one surface of the second
adhesive layer, and the support layer including a compression portion in a region corresponding to the lowermost end surface of the window.