32results about How to "Requirements for maintaining vacuum" patented technology

The invention provides a limiting block sealing device and a vacuumizing tire mold. The limiting block sealing device comprises a bottom plate, a tire side plate and an upper cover, wherein the uppercover is arranged above the bottom plate in parallel; the tire side plate is fixedly between the bottom plate and the upper cover in a sealing and fitting mode; a pattern mold is correspondingly arranged on one side of the tire side plate, and the pattern mold is fixedly connected with the bottom plate and the upper cover; and an inner mold plate is mounted on the outer wall of the pattern mold ina fitting mode. The limiting block sealing device of the vacuumizing tire mold is extruded and limited through a double-layer installed sealing ring, and the sealing ring is used as a transition, sothat the sealing between steel parts is achieved, the air flow of an outer cavity of the mold and an inner cavity of the mold is effectively blocked, the good sealing effect of the bolt hole connection part of the vacuumizing mold is achieved, and the vacuum degree requirement of the inner cavity of the mold is ensured; and the structure adopts a static sealing mode, so that the sealing effect ofthe bolt hole part is achieved, and the phenomenon that the sealing ring can fail due to deformation after long-term use is avoided.

The invention relates to a fastening and sealing device for a high-temperature ball mill tank and an assembly and disassembly method. It has a ball mill cylinder with one end open and an end cover fixedly connected to the open end of the ball mill cylinder through bolt sealing. The end is connected with an exhaust pipe for extracting the vacuum in the ball mill cylinder, and a lock clamp mechanism is provided between the ball mill cylinder body and the end cover. The clip hasp and the lock angle seat are fixed on the end cover. One end of the lock clip hasp is connected with the lock clip closing rod, and the other end of the lock clip hasp is turned over and folded on the lock angle seat. The present invention adopts the combination of bolts and locking mechanism before ball milling, which ensures the requirements of the ball mill cylinder for vacuum degree during vacuuming, and then removes the bolts for locking, and only retains the locking mechanism for locking during high-temperature ball milling, realizing The function of quick disassembly of the end cover of the ball mill tank at high temperature after operation is realized, which further meets the operation requirements of special materials.

The invention relates to an electron beam exposure machine film clip library system with encoding identification, which is composed of a Z-direction motion stage, a film frame which is used for placing film clips, a gear box, an ascending and descending stage and a computer control system, a drive motor drives a gear in the gear box to rotate under the control of the computer control system, thusdriving the Z-direction motion stage to do the Z-direction motion and allowing the film frame to do the Z-direction motion, the film clips on the film frame are driven to move upward or downward to the film receiving position of a valve port, the film clips are selectively sent to a film carrying stage for carrying out the exposure, at this time, the valve port and a door of the film clip libraryare closed simultaneously, the valve port is opened after the completion of the exposure of one film clip, then the film clip is retaken to the film clip library for preservation, and the exposure valve port is immediately closed; the computer control system further controls the Z-direction motion stage to move upward or downward to the position of the next film clip which needs to be exposed, then the valve port is opened again to carry out the exposure of the next film clip, and the process revolves like this till the film clips are completely exposed. The electron beam exposure machine film clip library system shortens the time of sending and taking the films, improves the positioning precision of sending and taking the films and ensures the exposure quality of the film clips.

The invention discloses a vacuuming control method and a system of ITO-PVD equipment, wherein the method comprises the following steps: a transmission cavity in the ITO-PVD equipment is set as a default cavity of a system dry pump, and is not allocated with a cold pump, and a cold pump is allocated for an ITO process cavity; for the default cavity, when other cavities besides the default cavity do not occupy the system dry pump, the system dry pump continuously vacuums the default cavity; and in the processing procedure, when the cavity in the ITO-PVD equipment requests for vacuuming, the vacuuming is performed according to the cold pump allocating condition of the cavity. The method saves the equipment cost and can effectively prevent the collision between hardware equipment when guaranteeing the vacuum degree requirement in the equipment processing.

The invention discloses a vacuum electrostatic spraying control system comprising an electrostatic spraying system control circuit and an infrared roaster. The vacuum electrostatic spraying control system further comprises a controller, a control panel circuit, a vacuum pump control circuit, an air exhausting system circuit, an air feeding system circuit, a vacuum degree collecting circuit of a vacuum cylinder, a roasting temperature collecting circuit of the vacuum cylinder and a main shaft rotating frequency-conversion driving circuit of the vacuum cylinder. The vacuum electrostatic spraying control system integrates a series of processes such as pre-treatment before surface spraying of a part, vacuum electrostatic spraying, paint curing, waste paint and solution recycling, and can be used for improving the spraying effect, ensuring the product quality, realizing the environmental friendliness and emission reduction, and reducing the production cost.

The invention provides a nitrogen sources ionizing method applied to a gas phase deposition growth system of semiconductor materials. In a growth system of semiconductor materials such as CVD, MOCVD, HVPE and MBE, etc., an external radio frequency field is applied to ionize nitrogen sources. The high frequency electric current is applied to electrodes of capacitances or inductance coils, and the high frequency electric field is applied by a gas path arranged between the capacitance plates or circling the inductance coils to speed up electrons and ionize gas molecules to generate plasmas. The device consists of a metallic flange(1), a cooling water pipeline(2), a quartz outer cover(3), a quartz fairing(5), a metal cover(6), a parallel plate capacitor(7), a thermoelectric couple(8), graphite(9), a bleeder hole(10), a radio frequency adapter(11), a radio frequency power source(12) and an air inlet(13), wherein the metallic flange(1) and the metal cover(6) are arranged on both ends of thequartz outer cover(3), and the gas path circling the air inlet(13) or the gas path of a growth platform is provided with capacitances or inductance coupling elements.

The present invention provides a vacuum sealing device and a vacuum tire mould. The vacuum sealing device includes an adjusting part, an elastic device and a first sealing element. A base has a circular slot disposed in the circumferential direction. The adjusting part is disposed in the circular slot through the elastic device. The elastic device is configured to provide an elastic force to enable the adjusting part to approach a middle mould sleeve. The first sealing element is embedded in the end of the adjusting part close to the middle mould sleeve. The first sealing element is configuredto realize sealing between the middle mould sleeve and the base. The vacuum sealing device further includes a second sealing element disposed between the adjusting part and the side wall of the circular slot. Such a vacuum sealing device improves insufficient vacuum degree in the prior art during mould closing and excessive wear to the seal ring.

The invention discloses a plate electrode fixing structure, belonging to the technical field of plasma etching. The plate electrode fixing structure comprises an insulating support, the insulating support is provided with a plurality of air inlets, and upper electrodes and lower electrodes are arranged around the air inlets. The insulating support is 5-1,000mm thick and is made of an insulating material such as ceramic, quartz, polytetrafluoroethylene or polycarbonate. The frequency of a radio-frequency power supply applied between the upper electrodes and the lower electrodes is 0-10GHz. Thedistance between the upper electrodes and the lower electrodes is 2-1,000mm. the area diameter of the upper electrodes and the lower electrodes is 20-3,000mm. By adopting the plate electrode fixing structure, the scope of uniform distribution of a plasma starter can be widened, and particularly good edge uniformity can be achieved. When the plasma starter is used, no air discharging can be causedby the plate electrode fixing structure, and a vacuum chamber can meet vacuum requirements.