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Flat plate micro heat pipe vacuumizing and liquid injection device and method thereof

A technology of flat micro heat pipe and liquid injection device, which is applied in indirect heat exchangers, lighting and heating equipment, etc. It can solve the problems of difficulty in ensuring the accuracy of vacuum degree and liquid filling rate, the difficulty of quantitatively controlling the amount of liquid filling, and large processes. Achieve the effects of automatic and precise injection, low cost, precise vacuum degree and liquid injection volume

Pending Publication Date: 2017-07-07
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the more popular method of vacuuming liquid injection is to open two holes on the flat micro heat pipe, which are used for vacuuming and liquid injection respectively, and the holes need to be sealed twice. This method of vacuuming liquid injection will easily cause large process errors. , it is difficult to guarantee the accuracy of vacuum degree and liquid filling rate
In addition, due to the extremely small volume of the steam chamber inside the flat plate micro heat pipe, directly vacuuming it will cause a large error, and it is also very difficult to quantitatively control the amount of liquid perfusion.

Method used

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  • Flat plate micro heat pipe vacuumizing and liquid injection device and method thereof

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Embodiment

[0019] Such as figure 1 As shown, a flat plate micro heat pipe vacuum liquid injection device is composed of a vacuum pumping part I and a liquid injection part II. The vacuum pumping part I is composed of a vacuum pump 4, a vacuum gauge 5, a gas collecting bottle 6, and a capillary tube 9. 4 is used to evacuate the flat micro heat pipe 7 and the gas collecting bottle 6, and the vacuum gauge 5 is used to observe the degree of vacuum; the liquid injection part II is composed of a syringe 8 and a capillary tube 9, and the liquid is injected into the flat micro heat pipe 7 through the syringe 8 ; The vacuuming hole and the liquid injection hole share the same hole on the flat plate micro heat pipe; during the process of vacuuming and liquid injection, the connection between the plate micro heat pipe and each component is controlled by a manual valve. The flat plate micro heat pipe vacuum liquid injection device provided in this embodiment has simple structure, low cost, high prec...

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Abstract

The invention provides a flat plate micro heat pipe vacuumizing and liquid injection device and a use method thereof. The flat plate micro heat pipe vacuumizing and liquid injection device is composed of a vacuumizing part and a liquid injection part. The vacuumizing part is composed of a vacuum pump, a vacuum meter, an air collection bottle and a capillary tube. The vacuum pump is used for vacuumizing a flat plate micro heat pipe and the air collection bottle. The vacuum meter is used for observation of the vacuum degree. The liquid injection part is composed of an injector and a capillary tube. Liquid is injected into the flat plate micro heat pipe through the injector. In the vacuumizing and liquid injection processes, connection of the flat plate micro heat pipe and all parts is controlled by a manual valve. The flat plate micro heat pipe vacuumizing and liquid injection device is simple in structure, low in cost, high in precision of the vacuum degree and liquid injection volume, easy to operate and reliable in operation.

Description

technical field [0001] The invention relates to a vacuumizing liquid injection device, in particular to a device for precisely vacuuming and injecting liquid into a flat micro heat pipe. Background technique [0002] Heat pipe is a heat transfer device with good thermal conductivity. Its heat transfer capacity is about tens or even hundreds of times that of copper and other high thermal conductivity materials. It is widely used in chemical industry, building materials, aerospace, metallurgy, power engineering and other technical fields. . With the rapid development of electronic technology, electronic components are developing towards the trend of high frequency, high speed, integration and modularization. This trend makes the heat dissipation of electronic components per unit volume increase sharply, and the heat dissipation problem seriously restricts the electronic information industry. development of. In recent years, flat micro-heat pipes have become a research hotspo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02F28D15/04F28D15/06
CPCF28D15/0283F28D15/04F28D15/06
Inventor 杨旸魏昕谢小柱胡伟李成彬
Owner GUANGDONG UNIV OF TECH
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