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Connection method and connection device of cpu module external wire

A technology for a CPU module and a connecting device is applied in the field of connecting methods and connecting devices for external wires of a CPU module, which can solve the problems of reducing the service life of finished products, oxidation at welding places, etc., and achieve the effect of improving the service life and avoiding oxidation.

Active Publication Date: 2015-09-02
CARDMATIX
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The second technical problem to be solved by the present invention is that, for the method of welding wires on the CPU module of the above-mentioned prior art of the prior art, it is easy to cause oxidation of the weld during the welding process, thereby reducing the defect of the service life of the finished product , providing a connection device for the external wires of the CPU module

Method used

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  • Connection method and connection device of cpu module external wire
  • Connection method and connection device of cpu module external wire
  • Connection method and connection device of cpu module external wire

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Embodiment Construction

[0035] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings.

[0036] Such as figure 1 As shown, in the first embodiment of the connection method of the CPU module external wire of the present invention, it is included to carry out the following steps with the ring-shaped rotating wire welding mechanism:

[0037] S1: Add rosin on the predetermined soldering point of the CPU module, and the added rosin needs an appropriate amount. In this embodiment, there are 2 predetermined soldering points, such as figure 1 Points A and B shown;

[0038] S2: Place a wire on the predetermined soldering point, place one end of the wire on the predetermined soldering point, that is, place a wire at point A and point B respectively, place one end of the wire on point A or point B, and the diameter o...

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Abstract

The invention discloses a connecting method and device for an external wire of a central processing unit (CPU) module. The connecting method comprises a first step of adding rosin on a preset welding spot of the CPU module, a second step of placing the wire on the preset welding spot and enabling one end of the wire to be placed on the preset welding spot, a third step of adding solder balls on the preset welding spot and a fourth step of enabling one end of the wire and the solder balls to be welded to the preset welding spot. The connecting device for the external wire of the CPU module comprises an annular rotating wire welding mechanism (1) for adding the rosin, placing the wire, adding the solder balls and welding the wire on the preset welding spot of the CPU module. The connecting method and the connecting device have the advantages that the rosin is added to the preset welding spot of the CPU module and protects a welded position and isolates air in welding, oxidation of the welded position is avoided, service lives of finished products are improved; simultaneously, the connecting device is small in size and convenient to install, a processing station is arranged on the periphery of a round turnplate, and processing efficiency is improved.

Description

technical field [0001] The invention relates to the field of mobile communication, and more specifically relates to a connection method and a connection device for an external wire of a CPU module. Background technique [0002] With the rapid development of information technology and economy around the world, economic and information exchanges between people are becoming more and more frequent. Cards and contact CPU cards (smart cards) that are being used in many fields now. At present, smart cards still play an irreplaceable role in people's lives. Whether it is a contact smart card or a contactless smart card, it has its own advantages and disadvantages. The wear and tear between the contact smart card and the card machine greatly shortens its service life. . The application of non-contact cards is limited in the occasions where radio frequency interference is severe; secondly, due to the energy transfer through coupling, the power consumption is required to be very low;...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/02H01R43/00
Inventor 熊曙光
Owner CARDMATIX