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Lead wire extraction device

A lead-out device and wire technology, which can be used in transportation and packaging, delivery of filamentous materials, thin material processing, etc., and can solve problems such as wire breakage

Active Publication Date: 2014-11-19
TOSHIBA MITSUBISHI-ELECTRIC IND SYST CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since very thin wires with a thickness of about a few tenths of a millimeter are used in many cases, if the above-mentioned very high tension is applied to such wires, wire breakage, etc. will occur.

Method used

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  • Lead wire extraction device
  • Lead wire extraction device
  • Lead wire extraction device

Examples

Experimental program
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Effect test

Embodiment approach

[0026] figure 1 It is a schematic configuration diagram showing the lead wire drawing device 100 according to the present invention. exist figure 1 Among them, the lead wire drawing device 100 is used in the case of performing ultrasonic vibration bonding of the lead wire 2 to the substrate 12 .

[0027] The wire drawing device 100 includes a wire reel 1 , a pressing part 3 , a first fixed wire receiving part 4 , a second fixed wire receiving part 5 and a movable wire receiving part 6 .

[0028] Multiple wires 2 are wound around a wire reel 1 . The conductive wire 2 has a thin linear shape and is, for example, an aluminum wire or a copper wire. It should be noted that, as an example, the line width of the conductive wire 2 is, for example, about a few mm, and the thickness is, for example, about a few tenths of a mm.

[0029] First, the lead wire 2 pulled out from the lead wire reel 1 is received by the first fixed lead wire receiving portion 4 . The first fixed wire rece...

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Abstract

A lead wire pull-out apparatus includes: a lead reel configured to have a lead wire wound thereon; two fixed lead bearings fixed at predetermined positions, on which the lead wire pulled out from the lead reel is slidable; a movable lead bearing arranged between the two fixed lead bearings, the movable lead bearing being movable in a vertical direction and configured such that a lower portion thereof is able to be in contact with the lead wire; and a press-down part configured to press down the movable lead bearing.

Description

technical field [0001] The present invention relates to a wire drawing device, and the present invention can be used, for example, in ultrasonic vibration bonding treatment. Background technique [0002] When bonding a conductive material or the like to an object to be processed, ultrasonic vibration bonding processing has conventionally been used (for example, refer to Patent Document 1 and Patent Document 2). [0003] For example, the following techniques are used when bonding a linear conductive material (hereinafter referred to as a wire) to a substrate. Multiple wires are wound on a wire reel from which the wires are drawn. Then, the drawn wire is brought into contact with the substrate at a predetermined position on the substrate, and an ultrasonic vibration bonding process is performed on the wire at the contact portion. [0004] prior art literature [0005] patent documents [0006] Patent Document 1: Japanese Patent Application Laid-Open No. 11-54678 [0007] ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65H51/28B65H51/22B65H59/02
CPCB65H2701/36B65H51/28B65H51/20B65H49/18B65H59/36B65H51/22B65H59/02
Inventor 三浦秀树米泽重之吉田章男西中大之小林宏
Owner TOSHIBA MITSUBISHI-ELECTRIC IND SYST CORP