Processing technic of sapphire substrate slice special for patterned substrate

Abstract

The invention discloses a processing technic of a sapphire substrate slice special for a patterned substrate. The processing technic comprises the following steps: A, chamfering; B, performing two-sided rough grinding on the sapphire substrate slice by using boron carbide of which the specification is W14-W20; C, cleaning the sapphire substrate slice by using an ultrasonic wave cleaning machine; D, performing two-sided fine grinding on the sapphire substrate slice by using boron carbide of which the specification is W5-W7; E, cleaning the sapphire substrate slice by using the ultrasonic wave cleaning machine; F, annealing the sapphire substrate slice; G, performing single-sided grinding on the front side of the sapphire substrate slice; H, cleaning the sapphire substrate slice by using the ultrasonic wave cleaning machine; I, preforming the single-sided rough polishing on the front side of the sapphire substrate slice; J, performing single-side fine polishing on the front side of the sapphire substrate slice; and K, cleaning the sapphire substrate slice by using the ultrasonic wave cleaning machine. Due to the adoption of the processing technic, all grinding and polishing processes in the machining process of the sapphire substrate slice special for the patterned substrate can be performed on a two-sided grinding-polishing machine, and the processing accuracy of a product is increased.

Description

technical field [0001] The invention relates to a processing technology of a crystal material, in particular to a processing technology of a sapphire substrate. Background technique [0002] LED lighting is the focus of a new round of high-tech high-tech enterprise development. Graphical sapphire substrates can effectively increase the brightness of LED chips and increase light efficiency by more than 30%. With the increase in demand for high-power LED chips, the demand for patterned sapphire substrates has also increased significantly. Therefore, the processing of sapphire substrates for patterned substrates is a very important link in the entire LED industry chain, and mature production technology is particularly critical. However, at present, the existence of technical barriers and the immaturity of the market have formed a blockage of information, resulting in the lack of a detailed standardized process for sapphire substrates in the industry, resulting in a high rate o...

AI Technical Summary

Problems solved by technology

However, at present, the existence of technical barriers and the high degree of immaturity of the market have formed a blockage of information, resulting in the lack of a detailed standardized process for sapphire substrates in the industry, resulting in a high rate of defective sapphire substrates in the industry and low production efficiency.

At present, the parameters of the sapphire substrates produced in the industry are the back surface roughness range of 0.80μm~1.20μm, the front surface roughness≤0.30nm, the total thickness deviation TTV≤5.00μm, the warp warp≤10.00μm, and the bow≤30.00 μm, the accuracy of the back roughness, warpage, and curvature is low, which leads to easy deformation and warping in the subsequent manufacturing process of patterned substrates using sapphire substrates

[0003] In addition, at present, in the process of processing sapphire substrates for patterned substrates in the industry, at least one double-sided grinding machine / polishing machine and one single-sided polishing machine / polishing machine are required, which not only requires high equipment investment, but also increases maintenance. cost and cost of use

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