Thickness and planeness measuring method for surface mounting technology (SMT) screen

A measurement method and flatness technology, which is applied in the field of SMT stencil thickness and flatness measurement, can solve the problems of not being able to express the thickness of a specific area and measuring the thickness of the stencil, and achieve improved measurement accuracy, reduced errors, and good technical effects Effect

Inactive Publication Date: 2013-07-24
KUNSHAN THETA MICRO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is the problem that the measurement of the thickness of the stencil is single and cannot represent the thickness of a specific area in the prior art

Method used

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  • Thickness and planeness measuring method for surface mounting technology (SMT) screen
  • Thickness and planeness measuring method for surface mounting technology (SMT) screen
  • Thickness and planeness measuring method for surface mounting technology (SMT) screen

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Effect test

Embodiment 1

[0022] A method for measuring the thickness and flatness of an SMT stencil, comprising the following steps: using a standard block to calibrate to determine the distance between two sensors; laying the stencil flat, moving it through a shaft system, and moving the two coaxial The laser displacement sensor moves to the starting position of the lower left corner of the screen; use the laser displacement sensor to move along a certain path to complete the scanning of the entire format of the screen, and collect the distance information between the upper and lower surfaces and each sensor; after scanning, according to The coordinates of the points and the obtained thickness information, the obtained distance between the upper and lower surfaces and the sensor and their coordinates are fitted into a thickness distribution diagram and a fitted surface diagram of the upper and lower surfaces.

[0023]

Embodiment 2

[0025] A method for measuring the thickness and flatness of an SMT stencil, which uses two coaxial laser displacement sensors to scan the entire format of the stencil and collect the distance information between the upper and lower surfaces and each sensor. After the scanning is completed, the obtained upper and lower The distance between the surface and the sensor and its coordinates are fitted into a thickness distribution map and a fitting surface map of the upper and lower surfaces. At the beginning, use the standard block to calibrate, determine the distance between the two sensors, place the stencil, and move the laser displacement sensor to the starting position of the lower left corner of the stencil by moving the shaft system, and then start to acquire thickness data and move along the figure 2 The path shown is moved to complete the scanning of the entire web of the stencil. The length interval of the thickness data collection during scanning can be set, and the thi...

Embodiment 3

[0028] SMT stencil thickness and flatness measurement method, including the following steps: use the standard block calibration to determine the distance between the two sensors; lay the stencil flat, move through the shaft system, and displace the two coaxial lasers The sensor moves to the starting position in the lower left corner of the screen; c) Use the laser displacement sensor to move along a certain path to complete the scanning of the entire format of the screen, and collect the distance information between the upper and lower surfaces and each sensor; d) After the scanning is completed , according to the coordinates of the points and the obtained thickness information, the obtained distance and coordinates between the upper and lower surfaces and the sensor are fitted into a thickness distribution diagram and a fitted surface diagram of the upper and lower surfaces. Set the length interval of the thickness data collection during scanning, and collect and save the thic...

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Abstract

The invention relates to a thickness and planeness measuring method for a surface mounting technology (SMT) screen. The thickness and planeness measuring method for the SMT screen mainly solves the problems that a screen thickness measuring method is single and can not represent the thickness of a specific area in the prior art. The thickness and planeness measuring method for the SMT screen comprises the steps of using a standard block for calibration to confirm the distance between two sensors, laying the screen flat and moving the two coaxial laser displacement sensors to a starting position of the left lower corner of the screen through axis movement, enabling the laser displacement sensors to move along a certain path to achieve scanning of the whole breadth of the screen, collecting distance information among the upper surface and the lower surface and the sensors, and fitting the obtained distances among the upper surface and the lower surface and the sensors and the obtained coordinates into a thickness distribution picture and a fitting curve picture of the upper surface and the lower surface according to coordinates of points and obtained thickness information after the scanning is finished. The problem is solved, and the thickness and planeness measuring method for the SMT screen can be used in a laser micromachining industry.

Description

[0001] technical field [0002] The invention relates to a method for measuring the thickness and flatness of an SMT stencil, in particular to a method for measuring the thickness and flatness using a laser displacement sensor in the laser microprocessing industry. Background technique [0003] In the laser micromachining industry, for SMT (Surface Mount Technology) stencils, it is necessary to measure the thickness of the stencil to check whether the stencil meets the requirements. Generally, a certain number of points are taken at average intervals in the stencil format to measure these The thickness of the point to represent the average thickness of the stencil, such as figure 1 . However, this measurement method can only indicate the average thickness of the overall stencil, but not the difference between the thicknesses of a certain part or point of the stencil, which cannot meet the needs of the industry. This patent invents a method for measuring thickness and flatn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/06G01B11/30
Inventor 魏志凌宁军沈晓
Owner KUNSHAN THETA MICRO
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