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Surface spraying and plating method for printed wiring board

A printed circuit board, local technology, applied in the direction of printed circuit, printed circuit manufacturing, printed component electrical connection formation, etc., can solve the problem of high production cost, achieve the effect of reducing the amount of gold plating and production cost

Inactive Publication Date: 2013-07-24
ZHEJIANG KAIHUA JIANKE ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the production process of printed circuit boards, gold plating is required for the surface treatment of the gold fingers. Usually, the whole board is gold-plated, and the production cost of this gold-plating method is relatively high.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0006] The present invention will be further described below in conjunction with specific examples. It includes the following steps:

[0007] 1. Use adhesive tape to paste the printed circuit board except for the gold finger;

[0008] 2. Gold-plate the gold fingers;

[0009] 3. Tear off the tape except for the golden finger;

[0010] 4. Cover the golden finger with tape;

[0011] 5. Spray tin on the place other than the golden finger;

[0012] 6. Remove the tape at the golden finger.

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PUM

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Abstract

The invention relates to a surface spraying and plating method for a printed wiring board. The method comprises the following steps of sticking an adhesive belt on the place except a golden finger on the printed wiring board; plating gold on the golden finger; removing the adhesive belt on the place except the golden finger; covering the golden finger with the adhesive belt; spraying tin on the place except the golden finger; and removing the adhesive belt on the golden finger. By the method, tin is sprayed onto the place except the golden finger, so that the gold-plating amount can be effectively reduced, and the production cost is reduced.

Description

technical field [0001] The invention relates to a surface spraying method of a printed circuit board. Background technique [0002] At present, in the production process of printed circuit boards, gold plating is required for the surface treatment of the gold fingers, and usually the whole board is gold-plated, and the production cost of this gold-plating method is relatively high. Contents of the invention [0003] The purpose of the present invention is to provide a method for spraying the surface of a printed circuit board that can reduce the amount of gold plating. [0004] The technical scheme adopted by the present invention is: a method for sputtering the surface of a printed circuit board. For the tape other than the gold finger, cover the gold finger with tape, and spray tin on the place other than the gold finger, and then remove the tape at the gold finger. [0005] By adopting the present invention, since the tin spraying treatment is performed on the places ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/14H05K3/18H05K3/40
Inventor 王小贵杨锋明王为成
Owner ZHEJIANG KAIHUA JIANKE ELECTRONICS TECH