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Multi-coating circuit board and production method thereof

A production method and circuit board technology, applied in printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve the problems of easy wear and failure, poor wear resistance of silver layer, corrosion, etc., and achieve high solderability and low cost , The effect of reducing the amount of gold plating

Inactive Publication Date: 2014-04-09
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The wear resistance of the silver layer is poor. If it is covered on the exposed key part (the part where the circuit on the pcb is in contact with the key), it will be easily worn out or corroded by air and other substances.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] In this embodiment, the surface of the button is covered with a 170mil nickel layer, and the nickel layer is covered with a 2mil gold layer; the pads and circuits are covered with a 9mil silver layer.

[0031] Present embodiment also provides the production method of above-mentioned multi-coated circuit board simultaneously, comprises following operation:

[0032] a. One copper→dry film→two copper→solderproof→text, and after the text process, plate a nickel layer on the button part of the circuit board, and then immerse it in the chemical gold plating solution to plate the button part on the circuit board upper gold layer;

[0033] b. immerse the circuit board in an electroless silver plating solution, so that the pad area and the circuit area on the circuit board are plated with a silver layer;

[0034] Before process a, it also includes coating the photosensitive dry film that can prevent the gold layer from adhering to the pad area and the circuit area of ​​the circ...

Embodiment 2

[0045] This embodiment provides a multi-coated circuit board, the surface of the keys is covered with a 200mil nickel layer, and the nickel layer is covered with a 1mil gold layer; the pads and circuits are covered with a 16mil silver layer.

[0046] Present embodiment also provides the production method of above-mentioned multi-coated circuit board simultaneously, comprises following operation:

[0047] a. One copper→dry film→two copper→solderproof→text, and after the text process, plate a nickel layer on the button part of the circuit board, and then immerse it in the chemical gold plating solution to plate the button part on the circuit board upper gold layer;

[0048] b. immerse the circuit board in an electroless silver plating solution, so that the pad area and the circuit area on the circuit board are plated with a silver layer;

[0049] Before process a, it also includes coating the photosensitive dry film that can prevent the gold layer from adhering to the pad area ...

Embodiment 3

[0060] This embodiment provides a multi-coated circuit board, the surface of the button part is covered with a 100mil nickel layer, and the nickel layer is covered with a 3mil gold layer; the pads and circuits are covered with an 8mil silver layer.

[0061] Present embodiment also provides the production method of above-mentioned multi-coated circuit board simultaneously, comprises following operation:

[0062] a. One copper→dry film→two copper→solderproof→text, and after the text process, plate a nickel layer on the button part of the circuit board, and then immerse it in the chemical gold plating solution to plate the button part on the circuit board upper gold layer;

[0063] b. immerse the circuit board in an electroless silver plating solution, so that the pad area and the circuit area on the circuit board are plated with a silver layer;

[0064] Before process a, it also includes coating the photosensitive dry film that can prevent the gold layer from adhering to the pa...

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PUM

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Abstract

The invention discloses a multi-coating circuit board. The key part surface is covered with a nickel layer of 100 to 200mil. The nickel layer is covered with a gold layer of 1 to 3mil. The pad and the circuit are covered with a silver layer of 8 to 16mil. The invention further discloses a production method of the multi-coating circuit board. Different coatings can be simultaneously electroless-plated on the same circuit board. According to the creative invention, the surfaces of the circuit and the pad of the same circuit board are respectively covered with different metal layers; the nickel gold layer which has the characteristics of good conductivity, easy OSP processing and low solderability is plated on the surface of the circuit which has the characteristics of high conductivity demand and no solderability demand; the pad part with a high solderability demand is covered with the silver layer with strong solderability; and the produced circuit board pad has the advantages of high solderability, good circuit conductive effect, good OSP processing effect and the like, wherein the advantages are not realized by the existing products.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a multi-coated circuit board and a production method thereof. Background technique [0002] In the PCB manufacturing industry, in order to ensure good solderability, electrical conductivity and oxidation resistance of the PCB board pad (PAD) or circuit, it is often required to plate precious metals such as gold, silver or nickel on the surface of the PAD or circuit. In the industry, electroplating or chemical plating is usually used to plate the coating. The existing electroless plating process is generally: first copper → dry film → second copper → solder mask → text → secondary dry film → chemical plating → film removal. Electroless plating is used to plate a gold layer on the surface of the PAD or circuit, which can improve its electrical conductivity, and the gold layer has high stability and is not easy to wear, but it is difficult to tin the sinking copper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/00
Inventor 贺连圣许人元唐景利
Owner VICTORY GIANT TECH HUIZHOU CO LTD
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