The invention relates to a preparing method of ultra-thin carrier copper foil capable of being stably stripped. The method comprises the specific steps: firstly, a plating solution is prepared, namely, a complexing agent potassium pyrophosphate, zinc sulfate, an addition agent A and an addition agent B are dissolved in water, mixing is carried out after clarification, and the pH value of the solution is adjusted; secondly, the carrier foil is put into the plating solution in the first step, a novel nano composite zinc coating is electroplated and serves as a stripping layer, and extremely-thin electrolysis copper foil ranging from 2 micrometers to 6 micrometers is electroplated on the stripping layer, and is called as the ultra-thin carrier copper foil. After the ultra-thin carrier copper foil is cured on an insulation substrate after high-temperature pressing, through the mechanical method, the carrier foil can be completely stripped. The stripping layer prepared through the method is extremely thin and uniform, the carrier foil is easy to completely and stably strip, and the good application prospect is achieved.