Preparation method of easy-to-peel ultra-thin carrier-attached copper foil with pure interface

A technology of carrier copper foil and ultra-thin copper foil is applied in the field of preparation of ultra-thin copper foil with carrier, which can solve the problems of tearing of carrier copper foil, high peeling strength of peeling layer, adhesion of ultra-thin copper foil, etc. The effect of surface flatness, stable peeling performance and pure interface

Active Publication Date: 2021-05-28
JIANGXI UNIV OF SCI & TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The purpose of the present invention is to provide a carrier copper foil and its preparation in order to overcome the problems such as the adhesion of the ultra-thin copper foil and the tearing of the carrier copper foil caused by the relatively high peeling strength of the peeling layer in the existing ultra-thin copper foil with a carrier. Method, an electrolytic copper foil, an extremely thin copper foil with a carrier and a preparation method thereof

Method used

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  • Preparation method of easy-to-peel ultra-thin carrier-attached copper foil with pure interface
  • Preparation method of easy-to-peel ultra-thin carrier-attached copper foil with pure interface
  • Preparation method of easy-to-peel ultra-thin carrier-attached copper foil with pure interface

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Embodiment approach

[0041] According to a preferred embodiment of the present invention, the organic layer contains an organic compound with a ring structure, preferably selected from organic compounds containing five-membered rings and / or six-membered rings, more preferably selected from melamine, benzotriazole, At least one of benzimidazole, 6-chloro-1-hydroxybenzotriazole and 1H-1,2,3-triazole.

[0042] According to the present invention, preferably, the alloy layer is obtained by electroplating from an alloy solution containing a complexing agent and at least one soluble sulfate.

[0043] In some embodiments of the present invention, preferably, based on the total amount of the alloy liquid, the content of soluble sulfate in the alloy liquid is 10-200g / L, preferably 30-80g / L; The content is 50-300g / L, preferably 150-200g / L. Optimum conditions are more conducive to obtaining a uniform alloy layer deposited on the surface, and are beneficial to reducing the surface roughness of the ultra-thin ...

Embodiment 1

[0100] (1) Preparation of carrier copper foil

[0101] Pickling treatment: Dilute the concentrated sulfuric acid to dilute sulfuric acid with a concentration of 10vol.%, pump it into the pickling tank, soak the copper foil with a thickness of 18 μm in the pickling tank, and surface the copper foil with deionized water after soaking For cleaning, the transmission speed of the conveying roller is 20m / min, and the circulation rate of the treatment liquid in each tank is 15L / min;

[0102] Electroplating treatment: the cleaned copper foil enters the electroplating tank filled with alloy solution for electroplating, wherein the concentration of nickel sulfate in the alloy solution is 15g / L, the concentration of zinc sulfate is 60g / L, and the concentration of potassium pyrophosphate is 180g / L , the conditions of the electroplating treatment include: the temperature is 30°C, and the current density is 3A / dm 2 , the time is 5s;

[0103] Coating treatment: After the copper foil afte...

Embodiment 2

[0115] (1) Preparation of carrier copper foil

[0116] Pickling treatment: Dilute the concentrated sulfuric acid to dilute sulfuric acid with a concentration of 10vol.%, pump it into the pickling tank, soak the copper foil with a thickness of 18 μm in the pickling tank, and surface the copper foil with deionized water after soaking For cleaning, the transmission speed of the conveying roller is 15m / min, and the circulation rate of the treatment liquid in each tank is 20L / min;

[0117] Electroplating treatment: the cleaned copper foil enters the electroplating tank filled with alloy solution for electroplating, wherein the concentration of cobalt sulfate in the alloy solution is 20g / L, the concentration of zinc sulfate is 30g / L, and the concentration of sodium citrate is 60g / L , the conditions of the electroplating treatment include: the temperature is 35°C, and the current density is 4A / dm 2 , the time is 4s;

[0118] Coating treatment: After the copper foil after the elec...

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Abstract

The invention relates to the technical field of electronic materials, in particular to a preparation method of an easy-to-peel ultra-thin carrier-attached copper foil with a pure interface. The carrier copper foil provided by the invention comprises a composite stripping layer containing an alloy layer and an organic layer, particularly, the alloy layer is obtained by electroplating an alloy liquid containing a complexing agent and at least one soluble sulfate, and the organic layer is obtained by coating organic liquid containing organic matters. Therefore, a composite stripping layer which is uniform in surface and stable in performance is formed on the upper surface of the copper foil, and the composite stripping layer has the characteristics of stable stripping performance and easy stripping after high-temperature pressing; meanwhile, the ultra-thin carrier-attached copper foil prepared by a specific method has the characteristics of easiness in stripping, fine crystal grains, compact structure, uniform thickness and pure interface, for example, the thickness of the ultra-thin copper foil is 2-6 [mu]m, the surface roughness is less than or equal to 2.5 [mu]m, and the stripping strength between the ultra-thin copper foil and the carrier copper foil is far lower than that between the ultra-thin copper foil and an insulating plate.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a method for preparing an extremely thin copper foil with a carrier that is easy to peel off and has a clean interface. Background technique [0002] 5G is a major change point in the field of mobile communications and the leading field of new infrastructure. It is known as "the new kinetic energy of economic development". Electronic copper foil has become an indispensable core basic material in 5G construction because of its excellent signal transmission function. As the development direction of the communication field in the next few years, on the one hand, 5G communication technology must use millimeter waves in order to achieve a transmission rate of up to 1Gbps or more. The disadvantage of this carrier is that the coverage area is small. To ensure signal coverage, it is necessary to build density. Larger base stations. On the other hand, the high-tech industries...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04C25D1/22C25D5/48C25D7/06
CPCC25D1/04C25D1/22C25D5/48C25D7/0614
Inventor 唐云志刘耀陆冰沪樊小伟李大双郑小伟谭育慧
Owner JIANGXI UNIV OF SCI & TECH
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