Preparing method of ultra-thin carrier copper foil capable of being stably stripped

Abstract

The invention relates to a preparing method of ultra-thin carrier copper foil capable of being stably stripped. The method comprises the specific steps: firstly, a plating solution is prepared, namely, a complexing agent potassium pyrophosphate, zinc sulfate, an addition agent A and an addition agent B are dissolved in water, mixing is carried out after clarification, and the pH value of the solution is adjusted; secondly, the carrier foil is put into the plating solution in the first step, a novel nano composite zinc coating is electroplated and serves as a stripping layer, and extremely-thin electrolysis copper foil ranging from 2 micrometers to 6 micrometers is electroplated on the stripping layer, and is called as the ultra-thin carrier copper foil. After the ultra-thin carrier copper foil is cured on an insulation substrate after high-temperature pressing, through the mechanical method, the carrier foil can be completely stripped. The stripping layer prepared through the method is extremely thin and uniform, the carrier foil is easy to completely and stably strip, and the good application prospect is achieved.

Description

technical field [0001] The invention relates to a preparation method of an ultra-thin carrier copper foil, in particular to a preparation method of an ultra-thin carrier copper foil capable of being peeled off stably, and belongs to the technical field of copper foil manufacture. Background technique [0002] With the rapid development of high integration and miniaturization of electronic products, copper foil, which is the main raw material of PCB, is also becoming thinner and thinner. The thinner the copper foil, the more difficult it is to produce, and it can easily wrinkle and tear during shipping. Therefore, the production technology of ultra-thin copper foil will also become a research hotspot in the future. [0003] At present, the preparation method of ultra-thin copper foil is to use a carrier foil with a certain thickness as a cathode, firstly form a peeling layer on it, and then deposit an ultra-thin copper foil of 2-6 microns. The electrodeposited ultra-thin co...

AI Technical Summary

Problems solved by technology

[0004] In the preparation process of ultra-thin copper foil, the peeling layer is very important. The peeling layer is mainly divided into: non-polar peeling layer, organic peeling layer and composite peeling layer; the inorganic peeling layer is mainly a metal layer or an alloy layer, and the peeling layer is conductive. Good resistance, but difficult to peel off; the organic peeling layer is nitrogen-containing compound, sulfur-containing compound and carboxylic acid, etc., commonly used are benzotriazole (BTA) and carboxybenzotriazole (CBTA), etc., this peeling layer conducts electricity Poor performance, uneven adsorption of organic matter, resulting in uneven peeling, some places are easy to peel off, and some places are difficult to peel off, etc.

Composite peeling layer often uses organic layer and inorganic layer as the peeling layer. Although there are many studies, there is no peeling layer that can be completely and stably peeled.

Images