Preparing method of ultra-thin carrier copper foil capable of being stably stripped

A technology of carrier copper foil and carrier foil, which is applied in the field of copper foil manufacturing, can solve problems such as uneven adsorption, uneven peeling, and difficult peeling, and achieve the effects of low cost, simple operation, and good conductivity

Active Publication Date: 2017-03-15
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the preparation process of ultra-thin copper foil, the peeling layer is very important. The peeling layer is mainly divided into: non-polar peeling layer, organic peeling layer and composite peeling layer; the inorganic peeling layer is mainly a metal layer or an alloy layer, and the peeling layer is conductive. Good resistance, but difficult to peel off; the organic peeling layer is nitrogen-containing compound, sulfur-containing compound and carboxylic acid, et

Method used

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  • Preparing method of ultra-thin carrier copper foil capable of being stably stripped

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Effect test

Embodiment 1

[0019] A preparation method of ultra-thin carrier copper foil, comprising the steps of:

[0020] 1) Plating solution preparation: dissolving the complexing agent potassium pyrophosphate, zinc sulfate, additive A and additive B in water respectively, and mixing them after clarification to obtain a plating solution, wherein the additive A is made of Co(NO 3 ) 2 6H 2 O and Fe(NO 3 ) 3 9H 2 O is a mixture formed at a mass ratio of 9:1, additive B is a mixture formed of oxalic acid and sodium thiosulfate at a mass ratio of 4:6, the content of complexing agent potassium pyrophosphate in the plating solution is 80g / L, sulfuric acid The content of zinc is 14g / L, the content of additive A is 10g / L, and the content of additive B is 8g / L;

[0021] 2) Electroplating: The carrier foil is placed in the above-mentioned plating solution as the cathode, and under the action of direct current, a layer of nano-scale composite galvanized layer is electroplated on the carrier foil as a peelin...

Embodiment 2

[0024] A preparation method of ultra-thin carrier copper foil, comprising the steps of:

[0025] 1) Plating solution preparation: dissolving the complexing agent potassium pyrophosphate, zinc sulfate, additive A and additive B in water respectively, and mixing them after clarification to obtain a plating solution, wherein the additive A is made of Co(NO 3 ) 2 6H 2 O and Ti(NO 3 ) 4 The mixture formed at a mass ratio of 7:3, the additive B is a mixture formed of formic acid and sodium hypophosphite at a mass ratio of 4:6, the content of complexing agent potassium pyrophosphate in the plating solution is 100g / L, and the content of zinc sulfate The content of additive A is 20g / L, the content of additive A is 6g / L, and the content of additive B is 10g / L;

[0026] 2) Electroplating: The carrier foil is placed in the above-mentioned plating solution as the cathode, and under the action of direct current, a layer of nano-scale composite galvanized layer is electroplated on the ca...

Embodiment 3

[0029] A preparation method of ultra-thin carrier copper foil, comprising the steps of:

[0030] 1) Plating solution preparation: dissolving the complexing agent potassium pyrophosphate, zinc sulfate, additive A and additive B in water respectively, and mixing them after clarification to obtain a plating solution, wherein the additive A is made of Mn(NO 3 ) 2 with Al(NO 3 ) 3 A mixture formed at a mass ratio of 9:1, additive B is a mixture formed of oxalic acid and ammonium chloride at a mass ratio of 4:6, the content of complexing agent potassium pyrophosphate in the plating solution is 40g / L, and the content of zinc sulfate The content is 10g / L, the content of additive A is 5g / L, and the content of additive B is 5g / L;

[0031] 2) Electroplating: The carrier foil is placed in the above-mentioned plating solution as the cathode, and under the action of direct current, a layer of nano-scale composite galvanized layer is electroplated on the carrier foil as a peeling layer, w...

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Abstract

The invention relates to a preparing method of ultra-thin carrier copper foil capable of being stably stripped. The method comprises the specific steps: firstly, a plating solution is prepared, namely, a complexing agent potassium pyrophosphate, zinc sulfate, an addition agent A and an addition agent B are dissolved in water, mixing is carried out after clarification, and the pH value of the solution is adjusted; secondly, the carrier foil is put into the plating solution in the first step, a novel nano composite zinc coating is electroplated and serves as a stripping layer, and extremely-thin electrolysis copper foil ranging from 2 micrometers to 6 micrometers is electroplated on the stripping layer, and is called as the ultra-thin carrier copper foil. After the ultra-thin carrier copper foil is cured on an insulation substrate after high-temperature pressing, through the mechanical method, the carrier foil can be completely stripped. The stripping layer prepared through the method is extremely thin and uniform, the carrier foil is easy to completely and stably strip, and the good application prospect is achieved.

Description

technical field [0001] The invention relates to a preparation method of an ultra-thin carrier copper foil, in particular to a preparation method of an ultra-thin carrier copper foil capable of being peeled off stably, and belongs to the technical field of copper foil manufacture. Background technique [0002] With the rapid development of high integration and miniaturization of electronic products, copper foil, which is the main raw material of PCB, is also becoming thinner and thinner. The thinner the copper foil, the more difficult it is to produce, and it can easily wrinkle and tear during shipping. Therefore, the production technology of ultra-thin copper foil will also become a research hotspot in the future. [0003] At present, the preparation method of ultra-thin copper foil is to use a carrier foil with a certain thickness as a cathode, firstly form a peeling layer on it, and then deposit an ultra-thin copper foil of 2-6 microns. The electrodeposited ultra-thin co...

Claims

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Application Information

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IPC IPC(8): C25D7/06
CPCC25D7/0614
Inventor 胡旭日王海振姜晓亮朱琪琪周鸥朱义刚
Owner SHANDONG JINBAO ELECTRONICS
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