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A preparation method of an ultra-thin copper foil with a carrier that is easy to peel and has a clean interface

A technology of carrier copper foil and copper foil, which is applied in the field of preparation of ultra-thin copper foil with carrier, can solve the problems of carrier copper foil tearing, high peeling strength of the peeling layer, and adhesion of ultra-thin copper foil, so as to improve the surface smoothness High degree, stable peeling performance, clean interface

Active Publication Date: 2021-11-16
JIANGXI UNIV OF SCI & TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The purpose of the present invention is to provide a carrier copper foil and its preparation in order to overcome the problems such as the adhesion of the ultra-thin copper foil and the tearing of the carrier copper foil caused by the relatively high peeling strength of the peeling layer in the existing ultra-thin copper foil with a carrier. Method, an electrolytic copper foil, an extremely thin copper foil with a carrier and a preparation method thereof

Method used

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  • A preparation method of an ultra-thin copper foil with a carrier that is easy to peel and has a clean interface
  • A preparation method of an ultra-thin copper foil with a carrier that is easy to peel and has a clean interface
  • A preparation method of an ultra-thin copper foil with a carrier that is easy to peel and has a clean interface

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Embodiment approach

[0041] According to one preferred embodiment of the present invention, the organic layer contains the organic substance having a cyclic structure, preferably selected from a five-membered ring and / or organics six-membered ring, more preferably selected from melamine, benzotriazole, benzimidazole, 6-chloro-1-hydroxybenzene and at least one triazole and 1H-1,2,3- triazole in.

[0042] According to the present invention, preferably, the alloy layer obtained by a plating solution containing a complexing agent and an alloy of at least one soluble sulfate.

[0043] In some embodiments of the present invention, preferably, based on the total content of the liquid alloy, the alloy is solution soluble sulfate 10-200g / L, preferably 30-80g / L; complexing agent content of 50-300g / L, preferably 150-200g / L. Using the preferred conditions more conducive to obtaining a uniform alloy layer deposited on the surface, help to reduce the roughness of the ultra-thin copper foil surface.

[004...

Embodiment 1

[0100] (1) Preparation carrier copper foil

[0101] Acid washing treatment: The concentration of concentration to 10 vol.% Dilute sulfuric acid, pumped into the acid wash tank, and the copper foil having a thickness of 18 μm was placed in the pickled tank, soaked, the copper foil was subjected to the copper foil after soaking. Cleaning, the transmission speed of the conveying roller is 20 m / min, and the fluid cycle rate in each tank is 15 L / min;

[0102] Electroplating treatment: The copper foil after cleaning enters the electroplating groove in which the alloy liquid is applied, wherein the nickel sulfate concentration in the alloy liquid is 15 g / L, the zinc sulfate concentration is 60 g / L, and the potassium pyrophosphate is 180 g / L. The conditions of the plating treatment include: temperature of 30 ° C, current density is 3A / DM 2 Time is 5 s;

[0103] Coating treatment: After the copper foil after the plating treatment, the copper foil was washed away from the ionize...

Embodiment 2

[0115] (1) Preparation carrier copper foil

[0116] Acid washing treatment: The concentration of concentration to 10 vol.% Dilute sulfuric acid, pumped into the acid wash tank, and the copper foil having a thickness of 18 μm was placed in the pickled tank, soaked, the copper foil was subjected to the copper foil after soaking. Cleaning, the transmission speed of the conveying roller is 15 m / min, and the fluid cycle rate in each of the troughs is 20 L / min;

[0117] Electroplating treatment: The copper foil after cleaning enters the electroplating groove in which the alloy liquid is applied is plated, wherein the cobalt sulfate concentration in the alloy liquid is 20 g / L, the zinc sulfate concentration is 30 g / L, sodium citrate concentration is 60 g / L. The conditions of the plating treatment include: a temperature of 35 ° C, current density is 4A / DM 2 Time is 4s;

[0118] Coating treatment: After the copper foil after the plating treatment, the copper foil was washed awa...

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Abstract

The invention relates to the technical field of electronic materials, in particular to a method for preparing an extremely thin copper foil with a carrier that is easy to peel off and has a clean interface. The carrier copper foil provided by the present invention includes a composite peeling layer comprising an alloy layer and an organic layer, especially the alloy layer is obtained by electroplating an alloy solution containing a complexing agent and at least one soluble sulfate, and the organic layer is obtained by electroplating The organic liquid containing organic matter is obtained by coating treatment, thereby forming a composite peeling layer with uniform surface and stable performance on the upper surface of the copper foil, which has the characteristics of stable peeling performance and easy peeling after high-temperature pressing; at the same time, using the specific The ultra-thin copper foil with carrier prepared by the method has the characteristics of easy peeling, fine grain, dense structure, uniform thickness, and clean interface. For example, the thickness of the ultra-thin copper foil is 2‑6μm, and the surface roughness is ≤2.5μm The peel strength between the ultra-thin copper foil and the carrier copper foil is much lower than that between the ultra-thin copper foil and the insulating board.

Description

Technical field [0001] The present invention relates to the technical field of electronic materials, and more particularly to a method of preparing a very thin-off-vehicle copper foil that is easily peeled, the interface. Background technique [0002] 5G is a major change point in the field of mobile communications. It is the field of current new infrastructure leadership, known as "new kinetic energy of economic development". Electronic copper foil has become an essential core basic material in 5G construction due to its excellent signal transmission function. As the development direction of the communication field, on the one hand, 5G communication technologies must use millimeter waves in order to achieve up to 1Gbps or more, the disadvantage of this carrier is small, to ensure the coverage of the signal, inevitably build density A larger base station, on the other hand, my country's key development high-tech industry, such as industrial Internet, enterprise clouds, artificial...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04C25D1/22C25D5/48C25D7/06
CPCC25D1/04C25D1/22C25D5/48C25D7/0614
Inventor 唐云志刘耀陆冰沪樊小伟李大双郑小伟谭育慧
Owner JIANGXI UNIV OF SCI & TECH
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