A kind of preparation method of ultra-thin carrier copper foil

Abstract

The invention relates to a preparation method of ultrathin carrier copper foil. The preparation method specifically comprises the following steps that (1) a plating solution is prepared, specifically, a complexing agent sodium gluconate, potassium dichromate, an additive A and an additive B are dissolved in water correspondingly and mixed after being clarified, and the pH value of the solution is adjusted; (2) carrier foil is soaked into an organic solution of a silane coupling agent, and a layer of organic film is formed through adsorption; and (3) the carrier foil is placed into the plating solution in the step (1), a layer of novel nanoscale composite chrome plating layer is formed through electroplating to serve as a peeling layer, then ultrathin electrolytic copper foil which is 2-5 microns thick is electroplated on the peeling layer, and the ultrathin carrier copper foil is obtained. The ultrathin carrier copper foil is subjected to high-temperature pressing and cured on an insulating substrate, and then the carrier foil can be completely removed through peeling by means of a mechanical method. The peeling layer prepared through the method is ultrathin and uniform, the carrier foil can be peeled easily, completely and stably, and the preparation method has great application prospects.

Description

technical field

[0001] The invention relates to a preparation method of copper foil, in particular to a preparation method of ultra-thin carrier copper foil, belonging to the technical field of copper foil manufacture. Background technique

[0002] With the continuous development of electronic products in the direction of miniaturization and multi-function, the line width and spacing of printed circuit boards are also developing in the direction of miniaturization, which requires the thinner copper foil used in fine circuits to have higher peelability. Especially in recent years, the wide application of lithium-ion batteries has provided a broader space for the development of ultra-thin carrier copper foil.

[0003] The thinner the copper foil, the more difficult it is to prepare. During the process of preparing, processing and transporting ultra-thin copper foil, problems of folding or edge tearing often occur. At present, the most commonly used solution is to electrodepos...

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