A kind of preparation method of ultra-thin carrier copper foil

A carrier copper foil and carrier foil technology, applied in the field of copper foil manufacturing, can solve the problems of high bonding strength, easy peeling, poor electrical conductivity, etc., and achieve the effects of low cost, simple operation and good electrical conductivity

Active Publication Date: 2019-04-16
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are two types of intermediate layers: organic and inorganic. The organic intermediate layer has poor conductivity, and there will be problems such as less adsorption of organic matter and easy peeling, and more adsorption of organic matter. Poor conductivity; the inorganic intermediate layer mainly refers to the alloy layer, which is laminated with composite foil at high temperature When it is on the substrate, because the peeling layer penetrates into the carrier foil and the ultra-thin copper foil layer, the bonding strength is relatively high, so that the carrier foil and the ultra-thin copper foil can only be partially peeled off or it is difficult to peel off

Method used

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  • A kind of preparation method of ultra-thin carrier copper foil

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Comparison scheme
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Embodiment 1

[0021] A preparation method of ultra-thin carrier copper foil, comprising the steps of:

[0022] 1) Plating solution preparation: Dissolve complexing agents sodium gluconate, potassium dichromate, additive A and additive B in water respectively, mix after clarification, adjust the pH value of the plating solution, wherein additive A is made of Ni(NO 3 ) 2 6H 2 O and Co(NO 3 ) 2 6H 2 O is a mixture formed by mixing 2:1 by mass ratio, additive B is a mixture formed by mixing hydroxyethyl cellulose and tartaric acid by mass ratio 1:2, the content of sodium gluconate is 70g / L, and the content of potassium dichromate is 15g / L, the content of additive A is 15g / L, the content of additive B is 10g / L, and the pH value is controlled to be 8.5;

[0023] 2) Immerse the 35μm thick carrier copper foil in the 5g / L silane coupling agent KH550 solution for 20s to form an organic film by adsorption;

[0024] 3) Place the carrier foil obtained in step 2) in the plating solution obtained in...

Embodiment 2

[0027] A preparation method of ultra-thin carrier copper foil, comprising the steps of:

[0028] 1) Plating solution preparation: dissolve the complexing agent sodium gluconate, potassium dichromate, additive A and additive B in water respectively, mix after clarification, adjust the pH value of the plating solution, wherein, additive A is made of Zn(NO 3 ) 2 6H 2 O and In(NO 3 ) 3 The mixture formed by mixing in a mass ratio of 3:2, additive B is a mixture formed by mixing piperidine and sodium thiosulfate in a mass ratio of 3:2, the content of sodium gluconate is 90g / L, and the content of potassium dichromate is 10g / L, the content of additive A is 5g / L, the content of additive B is 2g / L, and the control pH value is 10.5;

[0029] 2) Immerse the 40μm thick carrier copper foil in the 1g / L silane coupling agent KH550 solution for 20s to form an organic film by adsorption;

[0030] 3) Place the carrier foil obtained in step 2) in the plating solution obtained in step 1) as ...

Embodiment 3

[0033] A preparation method of ultra-thin carrier copper foil, comprising the steps of:

[0034] 1) Plating solution preparation: dissolve the complexing agent sodium gluconate, potassium dichromate, additive A and additive B in water respectively, mix after clarification, adjust the pH value of the plating solution, wherein, additive A is made of Mo(NO 3 ) 3 5H 2 O, additive B is a mixture formed by mixing sodium sulfite and ammonium chloride at a mass ratio of 3:1, the content of sodium gluconate is 100g / L, the content of potassium dichromate is 20g / L, and the content of additive A is 10g / L L, the content of additive B is 6g / L, and the control pH value is 10.5;

[0035] 2) Immerse the 40μm thick carrier copper foil in the 1g / L silane coupling agent KH550 solution for 20s to form an organic film by adsorption;

[0036] 3) Put the carrier foil obtained in step 2) into the plating solution obtained in step 1) as a cathode, control the temperature of the plating solution to 5...

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Abstract

The invention relates to a preparation method of ultrathin carrier copper foil. The preparation method specifically comprises the following steps that (1) a plating solution is prepared, specifically, a complexing agent sodium gluconate, potassium dichromate, an additive A and an additive B are dissolved in water correspondingly and mixed after being clarified, and the pH value of the solution is adjusted; (2) carrier foil is soaked into an organic solution of a silane coupling agent, and a layer of organic film is formed through adsorption; and (3) the carrier foil is placed into the plating solution in the step (1), a layer of novel nanoscale composite chrome plating layer is formed through electroplating to serve as a peeling layer, then ultrathin electrolytic copper foil which is 2-5 microns thick is electroplated on the peeling layer, and the ultrathin carrier copper foil is obtained. The ultrathin carrier copper foil is subjected to high-temperature pressing and cured on an insulating substrate, and then the carrier foil can be completely removed through peeling by means of a mechanical method. The peeling layer prepared through the method is ultrathin and uniform, the carrier foil can be peeled easily, completely and stably, and the preparation method has great application prospects.

Description

technical field [0001] The invention relates to a preparation method of copper foil, in particular to a preparation method of ultra-thin carrier copper foil, belonging to the technical field of copper foil manufacture. Background technique [0002] With the continuous development of electronic products in the direction of miniaturization and multi-function, the line width and spacing of printed circuit boards are also developing in the direction of miniaturization, which requires the thinner copper foil used in fine circuits to have higher peelability. Especially in recent years, the wide application of lithium-ion batteries has provided a broader space for the development of ultra-thin carrier copper foil. [0003] The thinner the copper foil, the more difficult it is to prepare. During the process of preparing, processing and transporting ultra-thin copper foil, problems of folding or edge tearing often occur. At present, the most commonly used solution is to electrodepos...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04C25D1/22
CPCC25D1/04C25D1/22
Inventor 朱琪琪王卫兴朱义刚姜晓亮周鸥杨宝杰
Owner SHANDONG JINBAO ELECTRONICS
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