Unlock instant, AI-driven research and patent intelligence for your innovation.

Polymer composition for microelectronic assembly

A technology of polymers and compositions, applied in the direction of electrical solid devices, circuits, electrical components, etc., can solve problems such as adhesive residue

Inactive Publication Date: 2013-07-24
SUMITOMO BAKELITE CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has been found that when the adhesive volatilizes or decomposes at temperatures equal to or greater than the solder reflow temperature, as taught in each of the above documents, to limit either solder reflow, significant contamination from the adhesive can remain or Requires special process equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polymer composition for microelectronic assembly
  • Polymer composition for microelectronic assembly
  • Polymer composition for microelectronic assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment B1

[0115] Example B1: Formulation of polycarbonate from 1,3-cyclohexanediol and endo-endo-2,3-norbornanedimethanol with formic acid in GBL

[0116] Dry polymer (4.54 g), prepared following the procedure in Polymer Example 3, was added to gamma-butyrolactone (GBL) to obtain a polymer solution with a total weight of 12.8 g (35.3 wt% resin content). Mix by roller for a minimum of 12 hours to obtain a clear, viscous, homogeneous polymer solution. The viscous solution was filtered by passing through a 1.0 μm disc filter made of PTFE, and the viscosity was measured at 25° C. with a Brookfield viscometer (Model DV I Prime) to be 17500 cPs. Formic acid (0.67 g, 5 wt% of the total solution) was then added and a homogeneous formulation was obtained after 8 hours of roller mixing.

Embodiment B2

[0117] Example B2: Formulation of polycarbonate from isosorbide and endo-exo-2,3-norbornanedimethanol with formic acid in GBL

[0118] A polycarbonate formulation according to an embodiment of the invention was prepared according to the procedure described in Example B1 using 5.25 g of dry polymer from Polymer Example 9 to obtain 15.0 g (35.0 wt % resin content) of a base polymer solution . The viscosity was determined to be 4600 cPs. Formic acid added was 0.78 g.

Embodiment B3

[0119] Example B3: Formulation of polycarbonate from isosorbide and 1,4-cyclohexanedimethanol with formic acid in GBL

[0120] A polycarbonate formulation according to an embodiment of the present invention was prepared according to the procedure described in Example B1 using 2.00 g of dry polymer from Polymer Example 10 to obtain 10.0 g (20.0 wt% resin content) of a base polymer solution . The viscosity was determined to be 8000 cPs. Formic acid added was 0.52 g.

[0121] C. Evaluation of Solder Fluxing Using Formic Acid in GBL

[0122] The use of the formulations of Examples B1-B3 provided data for evaluations C1-C3 as shown in Table 3, respectively. The method used for these examples was as follows: The formulation was dispensed as distinct spots with a 27-gauge needle onto a copper plate (1.7 cm x 3.4 cm) with a partially oxidized surface. Solder balls (Sn99.3Cu0.7; 600 μm) were carefully transferred on top of each spot on the copper plate. The entire board mounted o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
weightaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.

Description

[0001] Cross References to Related Applications [0002] This application is entitled to and claims priority to US Provisional Patent, Serial No. 61 / 416508, filed November 23, 2010, and entitled "Polymer Compositions for Microelectronic Assemblies." This provisional patent is incorporated herein by reference in its entirety. technical field [0003] Embodiments in accordance with the present invention generally relate to polymer compositions useful for mounting microelectronic components on substrates, and more particularly to providing both retention of microelectronic components in a desired position on a substrate and providing such components with Fluxing of the solder bonding of the substrate and retention in place as the polymer composition of the underfill. Background technique [0004] Although assembled electronic circuits have decreased significantly in size, the use of soldering as a method of forming electrical and fixable connections of electronic components to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00B23K1/20C08K5/09H01L21/56
CPCH05K13/0046H01L23/293H01L2224/73203C08L69/00H01L21/563H05K13/0465H01L2924/01322B23K1/203C08K5/09H01L2924/0002H01L2924/00B23K1/20H01L21/56H05K13/00
Inventor C·阿帕纽斯A·贝尔L·朗斯多夫W·C·P·塔桑
Owner SUMITOMO BAKELITE CO LTD