Thin film hybrid integrated circuit electroplating method

Abstract

The invention provides a thin film hybrid integrated circuit electroplating method. The method includes: sequentially depositing a TaN-TiWu-Au composite thin film on a microstrip substrate by utilizing a magnetic-control vacuum sputtering machine, using photoresist as a mask, etching away a gold layer and a TiWu layer through the wet etching process and completely retaining a TaN layer for realizing interconnection when locally electroplating an island circuit; and performing thermal oxidation processing in a drying box at the temperature of 200-280 DEG C for 180-360min to generate a tantalum oxide layer on the surface of the TaN layer, by the above processing, local circuit connection and relative insulation on a non-electroplated surface under the electroplating state can be realized so as to realize selectively local electroplating. By the thin film hybrid integrated circuit electroplating method, photoresist consumption is small, production cost is low, and environment-friendly production development trend is met.

Description

technical field [0001] The invention relates to an electroplating technology, in particular to an electroplating method for a thin film hybrid integrated circuit. Background technique [0002] With the continuous advancement of microwave and millimeter wave technology, the manufacturing process of thin film hybrid integrated circuits has also greatly improved. Since the film thickness of vacuum sputtering or evaporation is less than 1 micron, in order to ensure that the circuit loss is as small as possible, it is necessary to The film thickness is increased to 3∽5 times of the skin depth, so it needs to be thickened by electroplating. At present, the material of thin film circuits is mostly gold, because it has stable performance, is not easy to oxidize, is not easy to be corroded by acid and alkali, and is conductive. Excellent performance and low circuit loss, but there are always isolated island circuits in the circuit. At present, there are three main electroplating tech...

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Problems solved by technology

[0003] At present, these three technologies have some deficiencies in the application process to varying degrees. For example, the first full-board electroplating, due to the thick electroplating film layer, has a large corrosion factor in wet etching, which makes the strip line size smaller. The precision becomes poor, and the waste of precious metals in this process is serious, and the production cost is high; for example, the second type requires gold wire bonding and gold wire removal processes, which inevitably produces a large number of metal scratches and burrs, increasing circuit loss and Standing wave coefficient, and the work of gold wire bonding and gold wire removal is labor-intensive and low-efficiency; while the third pattern electroplating technology is carried out with glue, and the photoresist will gradually integrate into the plating process during the electroplating process. In the electroplating solution, the electroplating current density that can be tolerated becomes smaller after the electroplating solution is polluted, and the production efficiency is reduced. In serious cases, the electroplating solution is scrapped

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