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High-tenacity bismaleimide resin carrier structure adhesive film and preparation method thereof

A technology of maleimide resin and bismaleimide resin, which is applied in the field of bismaleimide resin carrier structure adhesive film and its preparation, can solve the problems of poor toughness and low peel strength, and achieve improved toughness and improved durability. Excellent heat and process performance

Active Publication Date: 2014-08-20
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention solves the problems of poor toughness and low peel strength of existing bismaleimide adhesives, and provides a high-toughness bismaleimide resin carrier structural adhesive film and a preparation method thereof

Method used

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  • High-tenacity bismaleimide resin carrier structure adhesive film and preparation method thereof
  • High-tenacity bismaleimide resin carrier structure adhesive film and preparation method thereof

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specific Embodiment approach 1

[0016] Specific embodiment 1: In this embodiment, a high-toughness bismaleimide resin carrier structure adhesive film is modified by 75-100 parts of bismaleimide resin and 75-100 parts by mass. agent, 75-100 parts of polymer blend alloy, 2-8 parts of polymer ultrafine powder, 1-4 parts of silane coupling agent, 15-25 parts of curing agent and carrier; wherein, the double Maleimide resin is composed of 443BMIPOBP type double horse resin containing ether ketone structure and 133BAPB type double horse resin containing ether bond in a mass ratio of 2:1.

[0017] The structural formula of the 133BAPB double-maleimide resin containing ether bonds described in this embodiment is, and its preparation method can be found in (Zhu Yulong, Yu Xinhai. Synthesis of Novel Bismaleimides Containing Ether Bonds, Insulating Materials [J], 2005 (5): 6~8) The published content.

[0018]

[0019] The advantage of this embodiment is as follows:

[0020] 1. The main resin of the adhesive in this...

specific Embodiment approach 2

[0025] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the high-toughness bismaleimide resin carrier structure adhesive film is made of 80-90 parts by mass of bismaleimide Resin, 80-90 parts of process modifier, 80-90 parts of polymer blend alloy, 4-6 parts of polymer ultrafine powder, 2-3 parts of silane coupling agent, 18-22 parts of curing agent and carrier become. Others are the same as the first embodiment.

specific Embodiment approach 3

[0026] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that: the described process modifier consists of allyl bisphenol A, allyl ether phenolic aldehyde and hyperbranched polysiloxane in mass ratio 7:2:1 ratio composition. Others are the same as those in Embodiment 1 or 2.

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Abstract

The invention relates to a high-tenacity bismaleimide resin carrier structure adhesive film and a preparation method thereof. The invention aims at solving the problems of the existing bismaleimide adhesive that the tenacity is poor and the peel strength is low. The adhesive film is prepared from bismaleimide resin, a technical modifier, macromolecule blending alloy, a curing agent, a silane coupling agent and a carrier. The preparation method of the adhesive comprises the following steps of: firstly pre-polymerizing the bismaleimide resin and the copolymeric modifier so as to prepare bismaleimide resin prepolymer, then uniformly mixing the bismaleimide resin prepolymer, the macromolecule blending alloy, the silane coupling agent and the curing agent so as to prepare sizing material through a mechanical blending method, and taking braided fabric as the carrier and preparing the film adhesive through a dual-roller hot rolling manner. The adhesive has the characteristics of high strength, thermostability and high tenacity and can be used for cementing thermostability metal and resin-based compound material structural members in the field of aerospace.

Description

technical field [0001] The invention relates to a bismaleimide resin carrier structure adhesive film and a preparation method thereof. Background technique [0002] Structural adhesive is an adhesive used for the bonding of load-bearing structural parts. It can transmit large static and dynamic loads, and can work reliably for a long time in the use environment. Compared with paste structural adhesives and solvent-based structural adhesives, film structural adhesives have the advantages of uniform and controllable adhesive layer thickness, low volatile content, high strength, high toughness, high durability and high reliability. It is widely used in aerospace field. [0003] Since the cured product of pure bismaleimide resin has a high crosslinking density and high temperature resistance, but its process performance and toughness are poor, it neither has the film-forming conditions nor can meet the toughness requirements of the structural adhesive film. Film-forming proces...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/04C09J179/08
Inventor 王德志曲春艳冯浩张杨毛勇宿凯李洪峰杨海冬王海民李公淳
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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