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Preparation method of fixed-point planar-view TEM sample

A sample preparation and sample technology, applied in the field of fixed-point plane TEM sample preparation, can solve the problem of difficulty in controlling the distance between the edge and the target, and achieve the effect of improving the success rate and quality

Inactive Publication Date: 2013-09-04
SHANGHAI HUALI MICROELECTRONICS CORP
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AI Technical Summary

Problems solved by technology

[0004] The invention provides a fixed-point planar TEM sample preparation method to overcome the problem in the prior art that the distance between the edge and the target is difficult to control during TEM sample preparation

Method used

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  • Preparation method of fixed-point planar-view TEM sample
  • Preparation method of fixed-point planar-view TEM sample
  • Preparation method of fixed-point planar-view TEM sample

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Embodiment Construction

[0020] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the drawings of the present invention all adopt simplified forms and all use imprecise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0021] Please refer to Figure 5 And combine Figure 1~4 , A method for preparing a fixed-point planar TEM sample 100 provided by the present invention includes:

[0022] Step 1: Position the target 120 of the TEM sample 100. Preferably, a laser or a focused ion beam (FIB) is used to locate the target 120 of the TEM sample 100. Specifically, a laser or FIB is used to leave a positioning mark 110 around the target 120 to facilitate positioning of the TEM sample 100 in the su...

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Abstract

The invention discloses a preparation method of a fixed-point planar-view TEM sample. The method comprises: step 1, positioning an objective of a TEM sample; step 2, grinding the TEM sample, and making the edge of the TEM sample with a distance of 5 to 15 microns to the objective; step 3, cutting the cross section of the TEM sample; and step 4, putting the TEM sample into a focused ion beam (FIB) to carry out a planar-view sample preparation. By combining methods of grinding, cross section cutting and FIB planar-view sample preparation, the success rate of the TEM fixed-point planar-view preparation is substantially increased, simultaneously the quality of the planar-view TEM sample is also greatly improved, and the failure analysis, the composition analysis and the like are provided with great help.

Description

Technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a method for preparing fixed-point planar TEM samples. Background technique [0002] When using TEM (transmission electron microscopy) to analyze the structure or material of the sample, not only cross-sectional analysis is required, but also planar analysis is required. However, compared with commonly done cross-sectional TEM, the sample preparation process of planar TEM is much more complicated. Especially for samples that require fixed-point analysis. The conventional sample preparation method is to mark with a laser or FIB (focused ion beam) near the target that needs fixed-point plane analysis, and then use manual mechanical grinding to grind the edge section of the sample to a distance of about 10 microns from the target, and then put it in FIB performs sample preparation for planar TEM. However, because the manual mechanical grinding method is difficult to accu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/28
Inventor 陈强王炯翀史燕萍
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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