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Device and method for elutriating and gluing wood chips

A technology of gluing and winnowing, applied in the direction of chemical instruments and methods, adhesives, applications, etc., can solve problems such as uneven distribution

Active Publication Date: 2013-09-04
利格朗木业技术公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This leads to an undesirably uneven distribution of the glue quantity in the pressed multilayer board

Method used

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  • Device and method for elutriating and gluing wood chips
  • Device and method for elutriating and gluing wood chips

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0026] as in figure 1 As can be seen in the figure, a first embodiment 1 of the plant for winnowing and gluing wood chips S etc. And the winnowing device 3 of S2.

[0027]The winnowing device 3 comprises a blowing device 5 which generates an obliquely upwardly directed deflection flow 6 for laterally deflecting the chips S; and a drop channel 7 in which the deflected particles can be optimized according to the size of the chips Different parabolic falls are followed in order to spatially separate the coarser chips S1 from the finer chips S2. The chips S1 , S2 descending successively substantially along the associated screening tracks S1 ′, S2 ′ are accumulated by a first collection device 9 for coarse wood chips and a second collection device 10 for fine wood chips to for reprocessing.

[0028] Furthermore, the device 1 according to the invention comprises, in the region of the drop channel 7 , a gluing device 11 with a spray device 14 for generating at least one aerosol 15...

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PUM

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Abstract

The invention relates to a device and method for elutriating and gluing wood chips. According to the invention, at least one elutriating apparatus is provided in order to fractionate the wood chips into at least one coarse chip fraction and one fine chip fraction, wherein the elutriating apparatus comprises a fall duct and is designed in such a way that the chip fractions pass through different gluing regions provided in the fall duct. Furthermore, at least one gluing apparatus is provided in order to glue the chip fractions in the gluing regions. Thus the chip fractions can be glued in a common apparatus specifically with a glue amount adapted to the particular average chip size.

Description

technical field [0001] The present invention relates to an apparatus and method for winnowing and gluing wood chips. Background technique [0002] Particleboards made of wood or similar lignocellulose-containing materials, especially flat-pressed boards, are preferably produced with a mechanically stable middle layer of relatively coarse wood chips and an upper and lower cover layer of relatively fine wood chips multilayer boards. In this case, the wood chips are present in a relatively broad size distribution, in contrast to the finer wood fibers used in fiberboards, such as MDF boards (medium density fibreboards). [0003] Thus, the problem arises when gluing coarse and fine wood chips as a rule, that the fine wood chips tend to absorb more glue than necessary due to their larger specific surface area, while the coarse wood chips absorb too little glue. This leads to an undesirably inhomogeneous distribution of the glue quantity in the pressed multilayer board. Further...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N1/02
CPCB27N1/0263B27N3/14Y10T156/15B27N1/02B07B4/02B27N1/029B27N3/02B27N3/04B32B21/02B32B21/042B32B21/13B01F25/721B27N3/00
Inventor 汉内斯·斯派德尔
Owner 利格朗木业技术公司
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