Laser processing device

Abstract

PURPOSE: A laser processing apparatus is provided to efficiently heat the periphery of a portion in which a chemical vapor deposition (CVD) process is performed, and to reduce the deformation of a target which will be processed. CONSTITUTION: A laser processing apparatus includes a cooling air feeding unit (167) and a laser unit (163) irradiating a laser beam to a portion which will be processed. The cooling air feeding unit jets material gas and hot air to the periphery of the portion on a target to be processed. The cooling air feeding unit jets the cooling air to the periphery from the outside a position from which the material gas and the hot air are jetted. An exhaust outlet for sucking the material gas, the hot air, and the cooling air is installed between the position from which the material gas and the hot air are jetted and a position from which the cooling air is jetted. [Reference numerals] (101A) Fixing unit; (101B) Operating unit; (112) Glass loading board; (151) Processing unit; (152) Control unit; (161) Gas window; (162) Laser irradiation monitoring unit; (163) Laser unit; (164) Gas supply exhaust unit; (165) Air heater; (166) Air heater control unit; (167) Cooling air feeding unit

Description

technical field [0001] The present invention relates to a laser processing device, in particular to a laser processing device for performing laser CVD (Chemical Vapor Deposition) processing. Background technique [0002] Currently, laser processing devices that use laser CVD (Chemical Vapor Deposition) to correct wiring defects on substrates used in display panels such as LCD (Liquid Crystal Display) panels and organic EL (Electro-Luminescence) panels are widespread. [0003] In a laser processing device using the laser CVD method, a raw material gas is supplied to the vicinity of the portion where the wiring on the substrate to be processed is corrected, and laser light is irradiated to the corrected portion on the substrate, and the raw material activated by the energy of the laser The gas acts as a film and accumulates in the corrected portion, thereby correcting the wiring on the substrate. However, when the raw material gas is supplied to the surface of the substrate, ...

AI Technical Summary

Problems solved by technology

[0008] However, when the substrate is heated, it is expected that the substrate will be warped due to thermal expansion, and the processing position and focus will be shifted, resulting in deterioration of processing quality.

In addition, when the amount of deflection increases, it is likely that the surface of the substrate will come into contact with a part of the laser processing device to cause damage.

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