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Exposure apparatus, exposure control system, and exposure method

An exposure device and management center technology, applied in the exposure device, exposure management system, and exposure field, can solve problems such as poor graphics, achieve the effects of correcting distortion errors and improving positional alignment accuracy

Active Publication Date: 2013-09-11
키오시아가부시키가이샤
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, if the copying position of the pattern of the mask on the substrate deviates from the predetermined position, pattern failure may occur.

Method used

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  • Exposure apparatus, exposure control system, and exposure method
  • Exposure apparatus, exposure control system, and exposure method
  • Exposure apparatus, exposure control system, and exposure method

Examples

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no. 1 Embodiment approach

[0023] use figure 1 Exposure apparatus 100 according to the first embodiment will be described. figure 1 It is a figure which shows the structure of the exposure apparatus 100.

[0024] The exposure apparatus 100 is used in a photolithography step in the manufacture of a semiconductor device. Exposure apparatus 100 is, for example, a scanning type exposure apparatus, and performs exposure processing for transferring the pattern of mask MK to substrate SB while synchronously scanning mask MK and substrate SB along the X direction. In the following description, in the plane along the surface SBa of the substrate SB, the direction perpendicular to the X direction is the Y direction, and the direction perpendicular to the X-Y plane is the Z direction.

[0025] At this time, considering the miniaturization requirements of semiconductor devices, it is difficult to technically increase the size of the fixed pattern by using a liquid immersion type exposure device in consideration o...

no. 2 Embodiment approach

[0102] Next, the exposure apparatus concerning 2nd Embodiment is demonstrated. Hereinafter, description will focus on portions different from those of the first embodiment.

[0103] FIG. 3 shows the configuration of an exposure apparatus 100j according to the second embodiment. The exposure device 100j is a liquid immersion exposure device that emits ArF light from a light source LSi, for example. Correspondingly, both the illumination optical system IOSj and the projection optical system POSj are refractive optical systems, and the space between the substrate SB held by the substrate stage 20j and the projection optical system POSj is filled with water by the water supply and recovery mechanism 110 . In addition, the mask MKj held by the mask stage 10j is a transmissive mask. Even if the liquid immersion exposure device is used, in controlling the aperture shape of the diaphragm IOSja disposed at the pupil position of the illumination optical system IOSj, for example, Fig...

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Abstract

According to one embodiment, there is provided an exposure apparatus including an acquisition unit, and a calculation unit. The acquisition unit obtains a plurality of measured values. The plurality of measured values is measured for a plurality of focus offset quantities different from each other. Each of the plurality of measured values represents positional deviation distribution within a shot area. The calculation unit calculates a plurality of distortion errors from the plurality of measured values and obtains a correlation between the focus offset quantity and alignment compensation value to compensate for the distortion error, in response to the plurality of focus offset quantities and the plurality of distortion errors.

Description

[0001] References for related applications [0002] This application enjoys the benefit of priority of Japanese Patent Application No. 2012-037417 filed on February 23, 2012, the entire contents of which are incorporated herein by reference. technical field [0003] This embodiment relates to an exposure device, an exposure management system, and an exposure method. Background technique [0004] In the exposure apparatus, exposure processing for transferring the pattern of the mask to the substrate is performed. At this time, if the transfer position of the pattern of the mask on the substrate deviates from a predetermined position, pattern failure may occur. In this way, it is desired to improve the accuracy of alignment. Contents of the invention [0005] According to an embodiment, an exposure apparatus including an acquisition unit and a calculation unit is provided. The acquisition unit acquires a plurality of measured values. A plurality of measurement values ​​a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/70783G03F7/70641G03F9/7019
Inventor 石行一贵
Owner 키오시아가부시키가이샤
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