Thinned micro-electromechanical microphone module

A micro-electromechanical microphone, thin technology, applied in the direction of electrical components, transducer circuits, sensors, etc., can solve problems such as considerable difficulty

Inactive Publication Date: 2013-09-18
MERRY ELECTRONICS (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in this existing design, the cavity 16 formed between the metal cover 14 and the circuit board 11 must have a sufficient volume to reserve the height of the wiring, so that the metal cover 14 must be maintained at a certain height. On this premise, it will be quite difficult to reduce the height of the metal cover 14

Method used

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  • Thinned micro-electromechanical microphone module
  • Thinned micro-electromechanical microphone module
  • Thinned micro-electromechanical microphone module

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Embodiment Construction

[0011] In order to illustrate the structure, features and effects of the present invention in detail, the following will be further described in detail in conjunction with specific embodiments and accompanying drawings.

[0012] image 3 Shown is the thin micro-electro-mechanical microphone module 20 provided by this embodiment, including a first circuit board 30, a micro-electro-mechanical chip 40, an application-specific chip 50 (Application-specific integrated circuit, ASIC), and a first Two circuit boards 60 .

[0013] A first groove 31 and a second groove 32 spaced apart from each other are recessed from the top surface of the first circuit board 30 , and a first signal layer 33 and a first ground layer 34 are buried inside.

[0014] The MEMS chip 40 is accommodated in the first groove 31 of the first circuit board 30 and attached to the bottom wall of the first groove 31 .

[0015] The second circuit board 60 covers the top surface of the first circuit board 30 and use...

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Abstract

The invention discloses a thinned micro-electromechanical microphone module. The thinned micro-electromechanical microphone module comprises a first circuit board, a micro-electromechanical chip, a specific application chip and a second circuit board, wherein the first circuit board is provided with a first groove and a second groove which are spaced mutually, and is provided with a first signal layer and a first ground layer; the micro-electromechanical chip is accommodated in the first groove of the first circuit board; the second circuit board covers the first circuit board, and is provided with a sound hole, a second signal layer and a second ground layer; and the specific application chip is arranged at the second circuit board, and faces to the second groove of the first circuit board. The thinned micro-electromechanical microphone module disclosed by the invention utilizes the design of two circuit boards which are attached up and down and then matches with an interior ground circuit to realize electromagnetic shielding, so that the purposes of reducing the packaging height and the packaging size can be achieved.

Description

technical field [0001] The invention belongs to the technical field of micro-electro-mechanical microphones, in particular to a thin micro-electro-mechanical microphone module that can reduce the packaging height. Background technique [0002] figure 1 It is an existing micro-electro-mechanical microphone module 10, which mainly includes a circuit board 11, a micro-electro-mechanical chip 12, a specific application chip 13, and a metal cover 14, wherein the micro-electro-mechanical chip 12 and the specific application chip 13 are respectively arranged on On the circuit board 11, and through a wire 15 to form an electrical connection between the two, the metal cover 14 is covered on the circuit board 11 to form a cavity 16 between the circuit board 11 to accommodate the micro-electromechanical chip 12 and a specific application chip 13, and use its own metal material to provide electromagnetic shielding effect. [0003] However, in this existing design, the cavity 16 formed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/08H04R3/00
Inventor 黄朝敬吕如梅陈弘仁邱冠勋
Owner MERRY ELECTRONICS (SHENZHEN) CO LTD
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