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Die device for thin temperature control material

A punching and thin technology, applied in the field of molds, can solve the problems of low punching quality and large resistance, and achieve the effects of convenient operation, quality improvement and cost saving.

Active Publication Date: 2013-09-25
SHANGHAI INST OF SATELLITE EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies in the prior art, the technical problem to be solved by the present invention is: Considering that the punching machine for thin temperature-controlled materials has a large resistance during the punching process, resulting in low punching quality, a thin temperature-controlling punching machine is invented. The punching device of the material punching machine during the punching process

Method used

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  • Die device for thin temperature control material
  • Die device for thin temperature control material
  • Die device for thin temperature control material

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Embodiment Construction

[0057] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0058] The structure of the die device provided according to the present invention is as follows: figure 1 , 2 As shown, the die device is mainly composed of handle 1, handle bracket 2, punching and pressing cam installation shaft 3, punching cam 4, pressing cam 5, lower die support 6, mounting bracket 7, guide rod 8, pressing Tight plate spring mounting seat 9, compression plate spring 10, flat washer 11, spring washer 12, hex head bolt 13, perforated plate spring mounting seat 14, perforated pl...

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PUM

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Abstract

The invention provides a die device for a thin temperature control material. The die device comprises a handle 1, a handle support 2, a punching cam and pressing cam installing shaft 3, a punching cam 4, a pressing cam 5, a lower die support 6, an installing support 7, a guide rod 8, a pressing plate spring installing seat 9, a pressing plate spring 10, a punching plate spring installing seat 14, a punching plate spring 15, a deep groove ball bearing 16, a bearing end cover 17, a punch 21, a punch fixing plate 22, a pressing plate 23 and a lower template 24. The die device has the advantages that first thin temperature control material punching quality is improved; second the operating process is convenient, and testing time and manpower can be saved; third material punching cost can be reduced by more than a hundred thousand yuan, and economic benefit is considerable; fourth the die device can be widely applied to design and manufacture of other dies; and fifth actual demands of final assembly and electric fitting operators can be met.

Description

technical field [0001] The invention relates to a mold, more specifically, to a punching die device for punching holes in a novel thin temperature-controlled material. Background technique [0002] There is no similar description or report on the thin temperature-controlled material punching machine at home and abroad, and the multi-layer coating of satellite temperature control is one of the main temperature control methods of satellites. It uses different layers of thin temperature-control insulation materials to rationally distribute the heat-absorbing and heat-dissipating areas of the sunny side and the back-side of the satellite when it is in orbit, and combined with active temperature control measures to achieve satellite on-orbit temperature control. [0003] The die device is the key mechanism of the punching device for thin temperature-controlled materials, because the thickness of the thin temperature-controlled materials is very thin, only 0.012mm. In the past, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/14
Inventor 王飞景加荣徐水湧黄涛唐伟峰
Owner SHANGHAI INST OF SATELLITE EQUIP
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