Chip thermal analysis method based on three-dimensional domain decomposition

Abstract

A chip thermal analysis method based on three-dimensional domain decomposition comprises the steps of adopting a non-overlapping domain decomposition method to perform thermal analysis of a chip system including a chip and a heat-radiating part, performing discrete grid division of different domains of the chip system respectively, setting an appropriate condition at each domain interface position to solve the domains and achieving convergence of a computed result of the interface position of the chip and the heat-radiating part through multiple overall iterations. By means of the chip thermal analysis method based on the three-dimensional domain decomposition, temperature distribution of the chip in the chip system can be quickly calculated.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit physical verification and analysis, and in particular relates to a method for accurately calculating chip temperature distribution. Background technique [0002] With the development of integrated circuits, more and more devices are included in the integrated circuits, and the power consumption per unit area shows an increasing trend. Therefore, the problem of heat generation of integrated circuits has become increasingly prominent. In order not to affect the normal operation and reliability of the circuit, it is necessary to equip the chip in the integrated circuit with an effective heat dissipation component (such as a heat spreader, a heat sink), and the chip and the heat dissipation component together form a heat conduction system. [0003] In the integrated circuit design process, in order to ensure the performance of the final chip, it is necessary to conduct chip thermal analysi...

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Problems solved by technology

Studies have shown that thermal analysis of a chip can result in errors of more than 10°C if heat dissipating components are not considered or approximate simplifications are made to their geometry

[0004] Since the size of heat dissipation components such as heat sinks is much larger than the size of the integrated circuit chip, the calculation time for the overall thermal analysis of the chip system will be greatly increased, and some fast algorithms cannot be applied to this thermal analysis problem involving multiple areas of different sizes

Therefore, the efficiency of chip thermal analysis method needs to be improved

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