Light-emitting module and lamp using same

A light-emitting module and light-emitting element technology, which is applied to optical elements for changing the spectral characteristics of emitted light, semiconductor devices of light-emitting elements, light sources, etc., can solve problems such as light output reduction, improve design freedom, and suppress extraction Efficiency reduction effect

Inactive Publication Date: 2013-10-02
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The LED chip is, when its temperature rises, the light output will decrease

Method used

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  • Light-emitting module and lamp using same
  • Light-emitting module and lamp using same
  • Light-emitting module and lamp using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0042] Overall composition

[0043] figure 1 (a) is a plan view of the light emitting module 1 of this embodiment. figure 1 (b) is viewed from the direction of the arrow figure 1 In the figure of the section cut along the line A-A', figure 1 (c) is the figure 1 (b) Enlarged cross-sectional view of the area surrounded by the dot-dash line A1.

[0044] like figure 1 As shown in (a), the light emitting module 1 includes a substrate 110 , a plurality of LED chips (semiconductor light emitting elements) 120 arranged in two rows on the substrate 110 , a wiring pattern 130 for supplying power to the LED chips 120 , and The sealing member 140 collectively seals a plurality of LED chips 120 for each row. In addition, if figure 1 As shown in (c), the light emitting module 1 has a chip mounting member 150 for bonding the LED chip 120 to the substrate 110 and a heat transfer member 160 for dissipating heat generated by the LED chip 120 to the substrate 110 .

[0045] Substrate ...

Embodiment approach 2

[0115] Hereinafter, the structure of the light emitting module 2 of this embodiment is demonstrated.

[0116] Figure 7 is a partial sectional view of the light emitting module 2 .

[0117] like Figure 7 As shown, the light-emitting module 2 has substantially the same configuration as the light-emitting module 1 of Embodiment 1. The difference from Embodiment 1 is that the heat transfer member 260 does not contain fine particles 161 but is composed of a single nanocomposite material. Therefore, in this embodiment, the heat transfer member 260 will be described. In addition, the same code|symbol is attached|subjected to the same structure as Embodiment 1, and description is abbreviate|omitted suitably.

[0118] The heat transfer member 260 has the function of dissipating the heat generated by the LED chip 120 to the substrate 110 as in the first embodiment. like Figure 7 As shown, the heat transfer member 260 is arranged between the four side surfaces of the outer periph...

Embodiment approach 3

[0137] Hereinafter, the structure of the light emitting module 1001 of this embodiment is demonstrated. In addition, the same code|symbol is attached|subjected to the same structure as Embodiment 1, and description is abbreviate|omitted suitably.

[0138] Figure 9 The light emitting module of this embodiment is shown, (a) is a plan view, (b) is a plan view of the state which removed the sealing member from the area enclosed by the dashed-dotted line A2 in (a), (c) is a partial cross-sectional view.

[0139] like Figure 9As shown in (a) to (c), the light emitting module 1001 includes a substrate 1110 , a plurality of LED chips 120 , a sealing member 1140 , and a plurality of heat transfer members 160 arranged in the outer peripheral regions of the plurality of LED chips 120 .

[0140] The substrate 1110 is formed in a rectangular plate shape, a wiring pattern is formed on one surface, and a circular ring-shaped frame 1118 in a planar view is arranged at a substantially cent...

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Abstract

A light-emitting module (1) is provided with: a substrate (110); an LED chip (120) arranged on the principal surface side of the substrate (110); a sealing material (140) which is arranged on the principal surface side of the substrate (110) so as to cover the LED chip (120) and converts the wavelength of the light emitted from the LED chip (120); and a heat transfer member (160) which thermally couples the side surface of the LED chip (120) with the principal surface of the substrate (110) and dissipates the heat generated by the LED chip (120) to the substrate (110). The heat transfer member (160) is constituted by a silicone resin, and nano particles made from ZrO2 and micro particles (161) made from MgO which are dispersed in the silicone resin and have higher heat transfer rate than the silicone resin.

Description

technical field [0001] The present invention relates to a light-emitting module using a semiconductor light-emitting element, and particularly relates to a technique for improving heat dissipation. Background technique [0002] In recent years, semiconductor light-emitting elements such as LED (Light Emitting Diode) chips, incandescent bulbs or halogen bulbs have higher efficiency and longer life than incandescent bulbs, so they are expected to be new light sources for lamps. The LED chip is such that when its temperature rises, the light output decreases. Therefore, in a lamp using the LED chip, it is important to suppress the temperature rise of the LED chip. [0003] Therefore, conventionally, lamps in which the temperature rise of the LED chip is suppressed have been proposed (see Patent Documents 1 and 2). [0004] The lamps described in Patent Documents 1 and 2 include: a light-emitting module composed of a substrate and a plurality of LED chips mounted on the substr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64F21S2/00F21V29/00F21Y101/02
CPCF21V23/002H01L25/0753H01L33/56H01L33/641H01L2224/83951H01L2224/8592H01L2224/48091H01L2224/48137H01L2224/73265H01L33/62H01L33/642H01L2933/0091H01L2924/181F21K9/232F21K9/64F21Y2115/10F21V3/12F21V29/85F21V13/02H01L2924/00014H01L2924/00012F21V9/08
Inventor 森俊雄青木郁子冈野和之堀内诚植本隆在
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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