Automatic bonding machine for connecting flexible printed circuit boards to glass lines

Abstract

The invention discloses an automatic wire bonder with a flexible circuit board in line connection with glass and relates to the technical field of automatic wire bonders. According to the automatic wire bonder with the flexible circuit board in line connection with the glass, an ACF component (2) is arranged on the left side of an automatic wire bonder body (1), a pre-pressing component (3) is arranged on the right side of the ACF component (2), a main pressing component (4) is arranged on the right side of the pre-pressing component (3), an FPC feeding machine (5) is arranged in the middle of the top of the automatic wire bonder body (1), an internal mechanical arm (6) is arranged at the front end of the top of the automatic wire bonder body (1), and a lower machine frame (7) is arranged on the lower portion of the automatic wire bonder body (1). According to the automatic wire bonder with the flexible circuit board in line connection with the glass, the yield is high, ACF attaching accuracy is high, and main pressing accuracy is high and practicality is strong due to the arrangement of a corresponding detecting device.

Description

Technical field: [0001] The invention relates to the technical field of automatic bonding machines, in particular to an automatic bonding machine for connecting flexible circuit boards and glass circuits. Background technique: [0002] At present, the automatic bonding machine (hereinafter collectively referred to as FOG) that connects the flexible printed circuit board (FPC) to the glass line is composed of a single machine such as semi-automatic equipment, ACF attachment equipment, FPC pre-pressing equipment, and FPC local pressing equipment. Fractional fully automatic FOG consists of glass loading unit, ACF attachment unit, FPC loading unit, FPC pre-pressing unit, FPC main pressing unit, product unloading unit, etc. For the current semi-automatic equipment, there are disadvantages such as low efficiency, poor yield rate, and many manpower. For the current fully automatic FOG equipment, the bonding capacity of small-sized single FPC is 4 seconds / piece, the ACF attachment ...

AI Technical Summary

Problems solved by technology

For the current semi-automatic equipment, the efficiency is low, the yield rate is poor, and the manpower is too much.

For the current fully automatic FOG equipment, the bonding capacity of small-sized single FPC is 4 seconds / piece, the ACF attachment accuracy is ±0.2mm, and the bonding accuracy after this pressing is ±20um. The labor cost is also getting higher and higher, so higher requirements are put forward for this type of equipment. The production capacity is 3.5 seconds / piece, the ACF attachment accuracy is ±0.1mm, and the bonding accuracy after pressing is ±8um. Some equipment cannot meet the market demand

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