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This utility model relates to the field of thermally conductive silicone pad technology, specifically to a 3M adhesive-type thermally conductive silicone pad that is easy to apply. It includes an adhesive body containing a thermally conductive silicone pad. Both the upper and lower surfaces of the thermally conductive silicone pad are coated with 3M adhesive. Z-shaped pieces are adhered and fixed to both sides of the lower surface of the thermally conductive silicone pad. A lower release paper is adhered and fixed to the center of the lower surface of the thermally conductive silicone pad, and an upper release paper is adhered and fixed to the upper part of the thermally conductive silicone pad. In this utility model, the 3M adhesive enhances the adhesion between the thermally conductive silicone pad and the chip / heat sink. The Z-shaped pieces allow for easy bonding by first removing the lower release paper, holding and flipping the Z-shaped pieces, and using the Z-shaped pieces for support and positioning. The thermally conductive silicone pad is gradually lowered, first bonding the center, and then gradually bonding outwards. The rigidity and support positioning of the Z-shaped pieces improve the bonding accuracy and flatness, thereby enhancing the thermal conductivity.