Back membrane attachment device for flexible substrates and method thereof
A flexible substrate and back film technology, applied in the direction of identification devices, instruments, etc., can solve the problems of flexible substrate 4 damage, offset, low attachment accuracy, etc.
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Embodiment 1
[0022] A back film attachment device for a flexible substrate, comprising a workbench 10 for fixing a substrate A, a strip-shaped film 30 is arranged above the workbench 10, and the lower surface of the strip-shaped film 30 is used to absorb the film B to be pasted , the upper surface of the band-shaped film 30 is provided with a pressure roller 40, when the pressure roller 40 moves downward, the band-shaped film 30 is inclined downward to drive the end of the film B to be pasted near the pressure roller 40 to be bonded to the corresponding end of the substrate A; When the roller 40 rolls on the upper surface of the strip film 30 in the horizontal direction, the lower surface of the film B to be pasted is attached to the upper surface of the substrate A. The core of the present invention is that the pressure roller 40 is arranged on the upper surface of the strip film 30, and the lower surface of the film B to be pasted is bonded to the upper surface of the substrate A by the r...
Embodiment 2
[0027] A method for attaching a back film of a flexible substrate, comprising the following steps:
[0028] Step 100: Fix the substrate A on the upper surface of the workbench 10, and adsorb the film B to be pasted on the lower surface of the strip film 30;
[0029] Step 200: moving the workbench 10 so that the substrate A is located under the film B to be pasted as a whole;
[0030] Step 300: Drive the pressure roller 40 to move downward, so that the end of the film B to be pasted near the pressure roller 40 is aligned with the corresponding end of the substrate A;
[0031] Step 400: Drive the pressure roller 40 to roll along the upper surface of the film B to be pasted to the other end of the film B to be pasted, so that the bottom surface of the film B to be pasted and the top surface of the substrate A are completely attached.
[0032] During specific implementation, first substrate A and film B to be pasted are respectively fixed on the workbench 10 and the strip film 30...
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