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Method and system for real-time allocation of machines in photolithography area

A machine and engraving area technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of low production efficiency and low utilization rate of machines in the photolithography area, so as to improve production efficiency and save waiting time , The effect of reducing the time to adjust the mask temperature

Active Publication Date: 2016-02-03
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The invention provides a method and system for real-time distribution of machines in the lithography area, which solves the problems of low utilization rate of machines in the lithography area and low production efficiency when dispatching machines in the existing lithography area

Method used

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  • Method and system for real-time allocation of machines in photolithography area
  • Method and system for real-time allocation of machines in photolithography area
  • Method and system for real-time allocation of machines in photolithography area

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Embodiment Construction

[0029] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention and are not intended to limit the invention.

[0030] Such as figure 1 The present invention shows a real-time allocation method of the photolithography area machine, including:

[0031] Step 1. Set the temperature layer values ​​corresponding to the different processes of the machines in each photolithography area according to the required temperature of the mask in different processes. As an example, refer to Table 1:

[0032]

[0033] Table 1

[0034] In Table 1, EQPA~EQPD represent different photolithography area machines, rep1~rep3 represent different processes, and the values ​​1~3 are the temperature layer values ​​corr...

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Abstract

The invention provides a real-time photoetching region machine platform allocation method and system. Given the characteristic that the temperatures of reticles of photoetching region machine platforms need increasing and lowering when the photoetching region machine platforms are replaced, wafer groups, to be processed, with the temperatures closest to the temperature in the execution technology process of the current wafer group serve as wafer groups in the next batch, and therefore the time for adjusting the temperatures of the reticles can be correspondingly reduced when the reticles are replaced; furthermore, because the rising speeds of the temperatures of the reticles of the photoetching region machine platform are higher than the cooling speeds of the reticles of the photoetching region machine platforms, wafer groups to be processed with reticle temperatures needing increasing are preferably sequenced, waiting time is further saved, and production efficiency is accordingly improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method and system for real-time assignment of machines in a photolithography area. Background technique [0002] In semiconductor manufacturing, the photolithography area has always been the bottleneck area of ​​production capacity. The machines in the lithography area are expensive, the process is precise and complicated, and at the same time, the machines in the lithography area are bound between the front and rear processes to eliminate the deviation of lithography. These factors are affecting the production capacity of the lithography area. [0003] In the photolithography process, the reticle is the core element of the photolithography area, which defines the pattern of the product. The number of photomasks in the factory is limited, and the conditions of use of the photomasks used by different products and different processes of the same product are different. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/66
Inventor 赵晨
Owner SEMICON MFG INT (SHANGHAI) CORP