Liquid metal transferring device and transferring method

Abstract

The invention discloses a liquid metal transferring device and a transferring method. The liquid metal transferring device comprises an open container used for containing liquid metal, a sealing cover used for covering the open container, a gas supply pipe used for injecting gas into the open container, a liquid guide pipe used for guiding liquid metal out of the open container, a gas supply device used for outputting gas and a heating device used for heating the liquid guide pipe. A first pipe passing hole and a second pipe passing hole are formed in the sealing cover, one end of the gas supply pipe is inserted into the first pipe passing hole, and the other end of the gas supply pipe is connected with the gas supply device. The liquid guide pipe penetrates the second pipe passing hole, a part of the liquid guide pipe is located outside the open container, the other part of the liquid guide pipe is located in the open container, and the heating device is arranged on the liquid guide pipe. The liquid metal transferring device and the transferring method have the advantages that the liquid metal is transferred automatically, workers can operate within a safe distance without directly contacting the liquid metal transferring device, and splashing can be avoided in the liquid metal transferring process.

Description

technical field [0001] The invention relates to the field of liquid metal transfer, in particular to a liquid metal transfer device and a transfer method. Background technique [0002] When producing electronic products, large-scale electronic components are generally installed on the circuit board through a manual plug-in process, and then the electronic components are fixed by manual soldering, wave soldering or selective wave soldering, and then enter the testing and assembly process. [0003] When selective wave soldering attaches the solder to the pad, it will bring a small amount of pad metal and flux residues into the tin furnace. Over time, these impurities may affect the alloy composition in the tin furnace, thereby affecting Welding quality is seriously affected. Therefore, it is necessary to periodically replace the polluted solder and clean the tin furnace. [0004] The replacement of the solder must be carried out in a molten state, but the temperature of the ...

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Problems solved by technology

[0006] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a liquid metal transfer device and a transfer method to solve the problem in the prior art that the molten solder needs to be poured from the tin furnace

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