Ejector pin type integrated circuit testing fixture

Abstract

The invention relates to an ejector pin type integrated circuit testing fixture. The ejector pin type integrated circuit testing fixture consists of a cover main body, clamping hooks, pressure plates, ejector pins, first springs, cover plates, second springs and clamping hook springs, wherein the cover plates, the pressure plates, the first springs and the ejector pins 4 are fastened into an ejector pin mechanism through fastening parts; the ejector pin mechanism is arranged in an inner cavity of the cover main body; the ejector pins are stepped; the first springs are arranged between the cover plates and the ejector pins; the ejector pins are fixedly arranged in the pressure plates under the action of spring force of the first springs; the first springs and the ejector pins can freely move up and down in the inner cavity; through holes are formed in the pressure plates; one end of each ejector pin penetrates through the through hole of the corresponding pressure plate, and is raised from the bottom surface of the corresponding pressure plate; and the pinheads of the ejector pins are raised from the planes of the pressure plates in an untested state. According to the ejector pin type integrated circuit testing fixture, the magnitude of force applied to chips can be controlled through the ejector pin mechanism by regulating the amounts of compression of the springs, and damage to the chips is avoided.

Description

technical field [0001] The invention is a jig used for semiconductor chip testing. Background technique [0002] The current technology and development trend of electronic packaging is to have higher electrical and thermal properties, light, thin, small, mass production, easy installation, use, and rework characteristics. The miniaturization and high-density packaging of devices is becoming more and more More, such as Wafer Level Chip Scale Packaging (WLCSP for short), MEMS, Micro-Electro-Mechanic System, Multi-Module Package (MCM), System in Package (SiP), inverted There are more and more applications such as mounting chips (FC, Flip-Chip). The emergence of these high characteristics puts forward higher and newer requirements for chip test fixtures. [0003] Traditional test fixtures such as Figure 6 As shown, its working principle is: put the IC into the test socket, and the pressure plate on the test cover is directly pressed or spun on the top of the chip to ensure th...

AI Technical Summary

Problems solved by technology

[0006] In addition, the chip will generate static electricity during the test process, which will affect the test results

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