The invention provides an elastic packaging structure for a
semiconductor chip. The elastic packaging structure comprises an upper
electrode, a lower
electrode, an annular packaging structure and a plurality of
chip subunits, wherein the plurality of
chip subunits are arranged between the upper
electrode and the lower electrode; the annular packaging structure is arranged on the side edges of theupper electrode and the lower electrode in a sealed mode and forms a
closed tube shell structure with the upper electrode and the lower electrode. According to the invention, the packaging cost can beeffectively reduced, the environmental adaptability of the
semiconductor chip is improved, the service life of the
semiconductor chip is prolonged, the universality is high, the packaging cost of
semiconductor chip failure can be reduced to the greatest extent, and the packaging yield of the
semiconductor chip is remarkably improved. The tube shell structure is a sealed structure, so the adaptability of the
semiconductor chip to the application environment can be greatly improved; the tube shell structure is filled with the
silica gel, so the insulation and
voltage resistance of the semiconductor chip can be greatly improved, the
voltage class of the semiconductor chip is higher, and the reliability of the semiconductor chip is higher.