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High-precision pressing device

A compacting device, high-precision technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of large impact force of hard pressure, lack of nitrogen protection, affecting the quality of solid crystals, etc., to achieve small impact force, Guarantee the effect of solid crystal quality

Active Publication Date: 2020-07-28
深圳市东昕科技有限公司
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  • Claims
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AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiments of the present application is to provide a high-precision pressing device to solve the technical problems in the prior art that the impact force of the hard pressure of the pressing mechanism is large during the process of pressing the lead frame and the lack of nitrogen protection affects the quality of the die-bonding

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Embodiment Construction

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0033] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0034] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and oth...

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Abstract

The invention provides a high-precision pressing device. The device comprises a base, a sliding assembly which is arranged on the base in a sliding mode, a driving assembly which drives the sliding assembly to get close to or away from the lead frame, an elastic pressing assembly which applies elastic pressure to the sliding assembly, a pressing plate assembly which abuts against the lead frame, and a nitrogen protection assembly which sprays nitrogen to the lead frame. The elastic pressing assembly comprises a first fixing base arranged on the base, an adjusting pressing rod connected to thefirst fixing base in a threaded mode, and an elastic piece with one end abutting against the sliding assembly and the other end abutting against the adjusting pressing rod. Through the elastic pressing assembly, the pressure applied to the lead frame by the pressing plate assembly is elastic pressure. The elastic pressure can be adjusted, the elastic pressure has the advantages of buffering effectand small impact force, compared with hard pressure of an air cylinder in the prior art, the lead frame is effectively prevented from being crushed, meanwhile, nitrogen charging protection is carriedout on the lead frame through the nitrogen protection assembly, and the die bonding quality is guaranteed.

Description

technical field [0001] The present application belongs to the technical field of chip bonding, and more specifically relates to a high-precision pressing device. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of a bonding material, and forms a key structural part of the electrical circuit. It acts as a bridge connecting the external wire. Most semiconductor integrated blocks require the use of lead frames, which are important basic materials in electronic information products. [0003] At present, the die bonding of the chip on the lead frame needs to be carried out under the condition that the lead frame is pressed tightly. However, the current pressing mechanism has the following deficiencies: 1. The flatness of the pressing mechanism cannot be adjusted, causing the lead frame to be u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/67144H01L21/67253H01L21/68785
Inventor 胡新荣
Owner 深圳市东昕科技有限公司
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