A printed circuit board chassis structure
A circuit board and chassis technology, applied in printed circuit, printed circuit manufacturing, electrical components, etc., can solve problems such as poor tinning, poor sealing, and inability to ensure the stability of chassis printing work, and achieve the effect of avoiding production quality problems
Active Publication Date: 2016-12-14
LONGCHUAN YAOYU TECH
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Problems solved by technology
At present, during the printing process of circuit boards, double-sided tape is usually used to paste the fixing pins and plastic edge strips on the seat surface of the base. When the fixing pins need to be removed after the process is completed, the double-sided The residual glue of the surface glue; when the double-sided printing of the circuit board is carried out, these residual glues are easy to stick to the surface of the circuit board facing the base, which will cause problems such as poor tinning. It should be pointed out that residual glue overflow between the bottom of each needle body and the bottom plate is easy to occur, and the sealing performance is poor; moreover, because the length of the bottom plate is smaller than the length of the chassis, it is impossible to ensure the entire chassis by relying on only one layer of the bottom plate. printing job stability
Method used
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[0015] Such as figure 1 As shown, the circuit board printing chassis structure according to the embodiment of the present invention includes a chassis 1, a pinhole 6 is opened vertically downward at the center of the chassis 1, and a flat needle body 3 is inserted into the pinhole 6, and a pinhole 3 is inserted in the center of the chassis 1 A number of positioning pins 2 are evenly distributed on the periphery of the thimble body 3, and these positioning pins 2 are distributed in a circular array with the flat thimble body 3 as the center point, and the top of each positioning pin 2 has a triangular top 5 with a triangular cross-section;
[0016] A bottom plate 4 is laid horizontally on the lower bottom of the chassis 1, and the bottom surface of each positioning pin 2 and the flat top pin body 3 is closely attached to the upper surface of the bottom plate 4. The thickness of the bottom plate 4 is 1.1mm, and each positioning pin 2 and flat top pin body 3 The distance between ...
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The invention discloses a novel circuit board printing underpan structure, which comprises an underpan, wherein the center of the underpan is provided with a pin hole into which a flat-top pin is inserted, and a plurality of positioning pins are evenly distributed around the flat-top pin; a bottom plate is horizontally laid on the bottom of the underpan, meanwhile, a plurality of attached plates are sequentially arranged layer by layer from top to bottom under the bottom plate, a layer of sealing plate is additionally arranged on the bottom of the underpan, the bottoms of the positioning pins are covered by the edge of the sealing plate, and a rubber strip is arranged between the sealing plate and the attached plates. The novel circuit board printing underpan structure has the beneficial effects: residual glue can be prevented from being left on the surface of a base, so that the production quality problem caused by residual glue can be solved; the novel circuit board printing underpan structure has the advantage that the novel circuit board printing underpan structure is convenient to dismount, mount and clean and can facilitate to increase the efficiency of circuit board printing; the printing underpan can become multifunctional.
Description
technical field [0001] The invention relates to the field of printing technology, in particular to a printed circuit board chassis structure. Background technique [0002] Printing technology is the entire process of visual and tactile information printing and reproduction. It is a technology that reproduces art, text, and images in batches on demand through planning, photography, word processing, art design, editing, color separation, plate making, printing, and post-press molding. Printed circuit boards have developed from single-layer boards to double-sided boards, multi-layer boards, and flexible boards, and are constantly developing in the direction of high precision, high density, and high reliability, continuously reducing volume, reducing costs, and improving performance. The development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, thin wire, small pitch, high reliability, multi...
Claims
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IPC IPC(8): H05K3/00H05K3/12
Inventor 游太勇
Owner LONGCHUAN YAOYU TECH