Light emitting diode module

Abstract

The invention discloses a light emitting diode module which comprises a ceramic substrate, a circuit layer, at least one light emitting element and a driving circuit element. The ceramic substrate is provided with a groove formed in the upper surface of the ceramic substrate, the circuit layer is arranged on the upper surface of the ceramic substrate, the light emitting element is arranged in the groove and electrically connected with the circuit layer, and the driving circuit element is arranged on the upper surface of the ceramic substrate and electrically connected with the circuit layer. Due to the fact that the ceramic substrate provided with the groove when formed is provided, the difficulty that the high-hardness ceramic substrate is hard to machine can be effectively avoided. Due to the fact that sealing glue is contained in the groove, the sealing glue is easily positioned and forms a lens shape.

Description

technical field [0001] The invention relates to a light emitting module, in particular to a light emitting module using a light emitting diode as a light source. Background technique [0002] Due to the advantages of energy saving, LEDs are gradually playing an important role in the field of lighting. In order to replace energy-consuming incandescent lamps, light-emitting diode bulbs must adopt a simpler structure or process in order to reduce the manufacturing cost to a level acceptable to consumers. [0003] Today's LED light bulbs have begun to adopt the method of chip direct packaging (Chip on Board), directly fixing the LED chip on the circuit board, abandoning the existing pre-packaged LED chip, and then installing the packaged LED components on the circuit board on the way. [0004] In addition, in order to quickly dissipate the heat generated by the LED chips during operation, most commonly used circuit boards use aluminum substrates or ceramic substrates to help d...

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Problems solved by technology

However, since the aluminum substrate is covered with an insulating layer and a circuit layer in sequence, the circuit layer and the aluminum substrate are electrically insulated by the insulating layer, and the thermal conductivity of the insulating layer is poor, which will reduce the overall heat dissipation effect.

The ceramic substrate is not easy to process to make grooves and other structures, so that the grooves cannot be used to fix the fluorescent glue or sealant, and the grooves cannot be used to control the reflection angle of the light emitted by the LED chip to achieve the desired light emission. angle

[0005] In addition, most of the existing light-emitting diode bulbs set the driving circuit in the lamp holder, and then connect the driving circuit with wires passing through the lamp holder. Usually, the size and weight of the driving circuit are relatively large, and the lamp holder needs to reserve a considerable internal space to accommodate drive circuit

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