Product parametric yield estimation method

A yield and parameter technology, applied in the field of microelectronics, can solve the problems of complex yield estimation process, difficult operation, and integrated circuit failure, etc., and achieve the effect of small calculation amount

Inactive Publication Date: 2013-12-04
XIDIAN UNIV
View PDF5 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The shortcomings of this method are: first, the circuit needs to be tested several times to obtain the data used for fitting the model; second, the process value that is most likely to cause integrated circuit failure is not easy to obtain; third, the yield estimation process is very difficult. complex and difficult to operate
The shortcomings of this method are: first, it is difficult to obtain the effec

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Product parametric yield estimation method
  • Product parametric yield estimation method
  • Product parametric yield estimation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0038] Refer to attached figure 1 Concrete steps of the present invention are as follows.

[0039] Step 1, get a sample.

[0040] Select the data in the product performance parameter test file with one-sided specification limit as the estimation sample.

[0041] The product performance parameter test file with a one-sided specification limit means that the performance parameter test data meeting the one-sided specification requirement set at the beginning of product design is recorded in the file.

[0042] The one-sided specification limit mentioned here refers to the performance parameters defined in the standard number JB / T3736.7-1994 of the Machinery Industry Standard of the People's Republic of China "Statistical Tools Commonly Used in Quality Management - Process Capability Index" must meet the product performance parameters The bounds of the scope that the t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a product parametric yield estimation method, which specifically comprises the steps of 1) obtaining estimation samples; 2) checking whether the estimation samples is in a state of one-sided truncated normal distribution or not and abandoning samples which are not in the state of one-sided truncated normal distribution; 3) obtaining the average value of the samples; 4) obtaining the standard deviation of the samples; 5) substituting the average value and the standard deviation of the samples into a process capability index formula to obtain process capability indexes; 6) checking the process capability indexes, wherein for the estimation samples with the process capability indexes which are not within an applicable interval, the specific parametric yield cannot be estimated; and 7) substituting the process capability indexes into a parametric yield and process capability index model to obtain the parametric yield. The product parametric yield estimation method disclosed by the invention can be used for estimating the parametric yield of performance testing data which is subject to truncation processing, and has the characteristics that the process is simple, the calculation is simple and convenient to perform and the practical value is high.

Description

technical field [0001] The technology belongs to the field of microelectronic technology, and further relates to a method for estimating the yield rate of product parameters in the field of quality and reliability evaluation of electronic components. The invention can be used to directly calculate the parameter yield under the condition of obtaining the data provided by the supplier or the tester. Background technique [0002] The yield rate of electronic component parameters refers to the ratio of the number of products whose characteristic parameters meet the specification requirements to the total number of manufactured products after the product is designed and manufactured. Parameter yield is an important performance of component quality and reliability, and there is a clear correlation between parameter yield, quality and reliability. The more unqualified components appear in the inspection process, that is, the lower the parameter yield, the lower the quality and rel...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06F19/00
Inventor 游海龙贾新章张宇梁涛顾铠
Owner XIDIAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap