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Photoelectric sensor and manufacturing method thereof

A technology of a photoelectric sensor and a manufacturing method, which is applied in the manufacturing field of resin parts, can solve the problems of increased equipment cost, complicated movement control of a laser head, etc., and achieve high-quality effects

Active Publication Date: 2016-05-04
ORMON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, it is conceivable to irradiate the joint surface with laser light from an oblique direction so as not to interfere with the laser light, but in this case, the equipment cost for irradiating the laser light increases, and the movement control of the laser head becomes complicated.

Method used

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  • Photoelectric sensor and manufacturing method thereof
  • Photoelectric sensor and manufacturing method thereof
  • Photoelectric sensor and manufacturing method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] Embodiments of the present invention will be described with reference to the drawings. In addition, in the drawings referred to below, the same reference numerals are assigned to the same or corresponding members.

[0038] figure 1 It is an overall configuration diagram of a photoelectric sensor according to an embodiment of the present invention. First refer to figure 1 , the overall structure of the photoelectric sensor 10 will be described. The photoelectric sensor 10 has a sensor head 12 and a retro-reflective plate 14 .

[0039] The sensor head 12 emits detection light A which is parallel light. The retro-reflective plate 14 is arranged to face the sensor head 12 , and the detection light A emitted by the sensor head 12 is reflected by the retro-reflective plate 14 to become return light B. In addition, the detection light A is, for example, visible light, but the wavelength region of the detection light A is not particularly limited as long as it is light retr...

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PUM

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Abstract

The present invention provides a resin part having high quality and produced by a simple manufacturing process, a photoelectric sensor using the resin part described above, and a method of manufacturing the resin part. A resin case includes a case (31) having a bonding surface (31c), and made of resin; an intermediate case (41) bonded to the bonding surface (31c) by welding, and made of resin that can transmit laser light; and a cap cover (21) arranged on the opposite side of the case (31) with respect to the intermediate case (41), standing on the intermediate case (41), and made of resin. The cap cover (21) includes a side portion (21a) standing from the intermediate case, and a top portion (21b) crossing the side portion (21a) on the position facing the bonding surface (31c) via the intermediate case (41). The height of the position (H) where the side portion (21a) and the top portion (21b) cross each other with the bonding surface (31c) being defined as a reference is the same on any position facing the bonding surface (31c).

Description

technical field [0001] The present invention generally relates to a resin component, a photoelectric sensor, and a method for manufacturing the resin component, and more particularly, to a resin component incorporating a plurality of members made of resin, a photoelectric sensor using the resin component, and a method for manufacturing the resin component. Background technique [0002] Regarding the method of joining resins using laser light, for example, Japanese Patent Application Laid-Open No. 2000-218698 discloses the following method of joining resins by laser light and its device, wherein the purpose is to improve the processing quality (quality) of the joint portion (Patent Document 1). [0003] In the bonding method of resins disclosed in Patent Document 1, a member transparent to the laser beam is arranged on the side close to the laser source, and a resin or other material member that absorbs the laser beam is arranged on the side away from the laser source. Make ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C65/16G01D5/26
CPCB29C65/1612B29C65/1635B29C65/1654B29C65/1677B29C65/1696B29C66/112B29C66/114B29C66/1222B29C66/1224B29C66/5344B29C66/542B29C66/543B29C66/61B29C66/65B29C66/652B29C66/71B29C66/73921B29C66/836B29K2995/0027B29L2031/3481G01S7/4813H01L31/0203B29K2023/12B29K2077/00B29K2023/06B29K2069/00B29K2055/02B29K2067/006B29K2081/04
Inventor 井上直人森崎祐造后勇树
Owner ORMON CORP