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Electric property detection method and electric property detection apparatus

A detection method and technology of electrical characteristics, applied in the direction of measuring devices, measuring electricity, measuring electrical variables, etc., can solve the problem that the influence of the third electronic component cannot be ruled out, and the electrical characteristics and voltage levels of the first and second electronic components cannot be correctly detected. unequal problem

Active Publication Date: 2014-01-01
NIDEC-READ CORPORATION
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Problems solved by technology

[0004] However, even if the voltage levels of the two contact points on the surface of the substrate connected to the connection portions on both sides of the third electronic component are set to the same level, in many cases, these respective contact points are not connected to both sides of the third electronic component. The resistance value of the wiring path between the connection parts is different
Therefore, the voltage levels of the connection parts on both sides of the third electronic component are different, and the influence of the third electronic component cannot be eliminated, and there is a problem that the electrical characteristics of the first and second electronic components cannot be accurately detected.

Method used

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  • Electric property detection method and electric property detection apparatus
  • Electric property detection method and electric property detection apparatus
  • Electric property detection method and electric property detection apparatus

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Embodiment Construction

[0027] refer to Figure 1 to Figure 4 An electrical characteristic detection device to which an electrical characteristic detection method according to an embodiment of the present invention is applied will be described.

[0028] First, based on figure 1 The detection object substrate 1 which is the detection object of the electrical characteristic detection apparatus 2 of this embodiment is demonstrated. The detection target substrate 1 is a laminated substrate formed by laminating a plurality of substrates, such as figure 1 As shown, first and second capacitors 3 , 4 connected in a triangular shape to form a triangular circuit, and an impedance element (such as an inductor) 5 having impedance are disposed inside it. The first and second capacitors 3 and 4 correspond to the first and second electronic components of the present invention, and the impedance element corresponds to the third electronic component of the present invention. The first connecting portion 3a of the ...

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Abstract

The invention provides an electric property detection method and an electric property detection apparatus which can fully inhibit the influence of the third electronic component in first-third electronic components disposed in a detection object substrate and forming a triangular circuit and can detect the electric property of the first electronic component and the second electronic component accurately. A second contact and a third contact are selected as a first selection contact and a second selection contact from a plurality of second contacts (7a-7d) and third contacts (8a-8d) disposed on the surface of the detection objection substrate (1) in such a manner that the resistance value of a wiring path (10) between the second contact and a first connecting part (5a) of the third electronic component (such as an impedance element (5)) and the resistance value of a wiring path (11) between the third contact and a second connecting part (5b) of the third electronic component form a combination of most proximate values. The electric property of the first and second electronic components (such as capacitors (3, 4)) is detected through first contacts (6a, 6b), the first selection contact and the second selection contact.

Description

technical field [0001] The present invention relates to an electrical characteristic detection method and a detection device for detecting the electrical characteristics of two electronic components among three electronic components constituting a triangular circuit embedded in a substrate to be tested. Background technique [0002] In recent years, with the rapid development of substrate manufacturing technology, the development of built-in substrates (embedded substrates) in which electronic components such as capacitors and coils are embedded in multilayer substrates has also been promoted. In such a miniaturized and complicated substrate, only contact points formed on the substrate can be electrically connected to external devices, so it is difficult to perform inspections for checking electrical characteristics of built-in electronic components. [0003] In addition, when a delta circuit in which three electronic components, the first to third electronic components, are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00G01R27/02
CPCG01R27/08G01R27/28
Inventor 山下宗寛
Owner NIDEC-READ CORPORATION
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