Grain sieve tray
A sieve tray and grain technology, applied in the field of microelectronics, can solve the problems of easy error, low efficiency, complicated operation procedures, etc., and achieve the effects of convenient operation, high success rate and high efficiency
Inactive Publication Date: 2014-01-01
RUGAO EADA ELECTRONICS
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Problems solved by technology
[0002] In the production and manufacture of semiconductor components, the semiconductor wafers in production are divided into N end face and P end face. The conventional sieve plate cannot distinguish the N end face and P end face of the GPP chip, and the operation procedures are complicated and impossible to peel off the blue film. Ensure consistency, low efficiency and error prone
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[0012] Below in conjunction with accompanying drawing, content of the present invention is described further:
[0013] As shown in the figure is a schematic diagram of the structure of the grain sieve tray, including the sieve tray frame 1, the screening hole 2, the suction hole 3 and the sieve tray 4. The P side of the GPP chip is much smaller than the N side, and the flatness of the P side channel is not as good as that of the N side after scraping the glass powder. In order to efficiently distinguish the polarity P side and N side of the chip. Through the research of the appearance and shape of the GPP chip by engineers, the specific gravity of the two sides of the chip is different. When the sieve plate is shaken, after the chip hits, the heavy side is easy to be sucked. The area of the two sides of the GPP chip is divided into different sizes. The position of the suction hole is prone to air leakage and cannot be sucked. The N side must be sucked. The success rate o...
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The invention discloses a grain sieve tray capable of distinguishing GPP chips in the field of micro-electronics. The grain sieve tray is composed of a sieve tray frame and a sieve tray body, wherein the sieve tray body is located on the upper surface of the sieve tray frame. The grain sieve tray is characterized in that the sieve tray body is provided with sieve holes formed in the length and breadth directions in order, the diameter of the sieve holes is equal to that of a face N of sieved chips, an exhaust hole is formed in the bottom of each sieve hole, the sieve tray frame is a sealed cavity, the exhaust holes are communicated with the sealed cavity of the sieve tray frame, and a suction hole is formed in one lateral surface of the sieve tray frame and is connected with a vacuum pump. The grain sieve tray has the advantages of being high in success rate of distinguishing polarities, convenient to operate, high in efficiency and the like.
Description
technical field [0001] The invention relates to a manufacturing tool of semiconductor components in the field of microelectronics, in particular to a grain sieve plate capable of distinguishing GPP chips. Background technique [0002] In the production and manufacture of semiconductor components, the semiconductor wafers in production are divided into N end face and P end face. The conventional sieve plate cannot distinguish the N end face and P end face of the GPP chip, and the operation procedures are complicated and impossible to peel off the blue film. Ensure consistency, low efficiency and error-prone. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies of the prior art, and provide a grain sieve plate capable of effectively distinguishing the N surface and the P surface of the GPP chip. [0004] The present invention is achieved through the following technical solutions: [0005] A grain sieve tray, which is c...
Claims
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Login to View More IPC IPC(8): H01L21/67B07B1/28B07B1/46
CPCH01L21/67271
Inventor 黄建山陈建华张练佳梅余峰
Owner RUGAO EADA ELECTRONICS