Feeding systems for substrate processing and substrate cutting machines

Abstract

The invention discloses a feeding system for substrate processing and a substrate cutting machine: comprising: a material reclaiming device, which includes a lifting device and a vacuum chuck arranged at one end of the lifting device, and the lifting device pushes the vacuum chuck to The substrate at the feeding position is fixed on the vacuum chuck by absorbing the substrate through the vacuum chuck for retrieving; it also includes a feeding device, which is connected with the retrieving device, and is used to connect the retrieving device and its The adsorbed substrate is pushed to the processing position. Since the vacuum chuck adopts one surface of the adsorption substrate to achieve material retrieving, compared with the method of chuck retrieving, there is no need to adjust the clamping distance of the chuck, and the maintenance is simple. In addition, since there is no chuck, there is no gasket wear, the vacuum suction cup will not fail to grasp due to the wear of the gasket, which improves the operating efficiency and production capacity of the equipment. In addition, it also saves a lot of gaskets used on the chuck, so it also saves a lot of cost. .

Description

technical field [0001] The invention relates to the field of display device manufacturing, and more specifically, to a feeding system for substrate processing and a substrate cutting machine. Background technique [0002] The cutting of glass substrate is an important process of liquid crystal panel. At present, in the cutting process of glass substrate, such as figure 1 As shown, the feeding method of the glass substrate in the cutting machine before cutting is to use the feeding chuck 11 (Chuck) to clamp the residual material on the edge of the glass substrate 700 at the feeding position (the glass between the display screens or the edge of the display screen Residual material), the cylinder 10 or the motor drives the whole set of feeding chucks 11 (Chuck) of the cutting machine to drive the entire glass substrate 700 to the downstream processing position, and the bottom of the glass substrate 700 is provided with rollers 15 to make the glass substrate stable to the proce...

AI Technical Summary

Problems solved by technology

[0003] Since the thickness of the current glass substrate is not unique, if the above-mentioned supply chuck 11 is used to feed the material by clamping, the clamping distance of the chuck must be adjusted frequently for glass substrates of different thicknesses, and the process is cumbersome.

like figure 2 As shown, the material supply chuck 11 is also provided with buffer gaskets. As the machine is used longer and longer, the wear of the gasket 13 that acts as a buffer on the surface of the material supply chuck 11 will become increasingly serious, which will lead to There is an abnormality in the machine, so the frequency of adjusting the gasket 13 is increased to eliminate the abnormality, and the price of the gasket is high, and the total number of gaskets 13 in one machine is large, which not only increases the workload of personnel replacement (loading), but also increases Increased production costs and reduced production capacity

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