Chip capacitor provided with internal interconnection structure and manufacturing method thereof

Abstract

The invention discloses a chip capacitor provided with an internal interconnection structure and a manufacturing method of the chip capacitor. The chip capacitor provided with the internal interconnection structure comprises a multilayer chip capacitor body, inner electrodes and outer electrodes, wherein the multilayer chip capacitor body is integrally formed by sintering multiple dielectric medium layers; two oppositely arranged inner electrodes are arranged in the multilayer chip capacitor body; the outer electrodes are arranged on the upper surface and the lower surface of the multilayer chip capacitor body; the outer electrodes are electrically connected with the inner electrodes through interconnection holes in the multilayer chip capacitor body. A multiplayer ceramic manufacturing process is mainly adopted, tape-casting pieces are stacked and pre-pressed to manufacture the dielectric medium layers, the inner electrodes are manufactured by hole punching, hole filling and printing, the outer electrodes are sputtered and plated, and finally the capacitor is obtained. The chip capacitor is simple in process and easy to operate, and has higher capacitance compared with ordinary capacitors of the same appearance and size.

Description

technical field [0001] The invention belongs to the technical field of chip capacitors, and in particular relates to an internal interconnection structure of a chip capacitor and its preparation. Background technique [0002] Ordinary single-layer chip capacitors adopt a structure in which electrodes are covered on the upper and lower surfaces of ceramic dielectric sheets to form a structure of ordinary parallel plate capacitors, thereby obtaining corresponding capacitance. The structural design is limited by the size of the capacitor. Generally speaking, the side length B is less than 1mm, and the thickness D is greater than 0.1mm. At the same time, it is limited by the dielectric properties of ceramic materials (including dielectric constant, temperature characteristics, etc.). When it is determined with the ceramic material used, its capacitance is also fixed. However, in many applications, due to limited assembly space, the external dimensions of capacitors have been fi...

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Problems solved by technology

However, in many applications, due to limited assembly space, the external dimensions of capacitors have been fixed. For example, if ordinary single-layer chip capacitors are u

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