Method for arranging grinding pad, grinding pad arranging device and grinder table

A pad organizer and grinding pad technology, which is applied in the directions of grinding machine tools, grinding devices, and parts of grinding machine tools, can solve the problems of easy collision with the grinding head, reduced product yield, and easy collision with other adjacent parts, etc. Product yield, the effect of avoiding contamination of the wafer

Active Publication Date: 2014-01-22
SEMICON TECH INNOVATION CENT(BEIJING) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the grinding disc 130 needs to move up and down (up / down) in the process of going back and forth to the cleaning area, on the one hand, it is easy to collide with the grinding head during the upward and downward movement of the grinding disc, so that the inside of the grinding head Wafers are prone to defects such as scratches or dishing due to collisions, resulting in a decrease in product yield; on the other hand, the grinding disc is also prone to collisions with other adjacent Once the components collide, a large amount of particulate matter will be generated, and these particulate matter will easily contaminate the wafer, further reducing the yield of the product

Method used

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  • Method for arranging grinding pad, grinding pad arranging device and grinder table
  • Method for arranging grinding pad, grinding pad arranging device and grinder table
  • Method for arranging grinding pad, grinding pad arranging device and grinder table

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Embodiment 1

[0033] This embodiment provides a polishing pad finishing method, please refer to figure 2 and image 3 , when the wafer is ground, the grinding disc 230 presses down to arrange the grinding pad 210, and during the process from grinding one wafer to the next wafer grinding, the grinding disc 230 stays at the grinding position with zero pressure. Pad 210 on. Since the grinding disc 230 rests on the grinding pad 210 with zero pressure during the process from grinding a wafer to before starting the grinding of the next wafer, the grinding disc 230 can be used during the entire process of grinding a batch of wafers. It stays on the grinding pad 210 all the time without reciprocating movement between the cleaning area, thereby avoiding the repeated upward and downward movement of the grinding disc 230. On the one hand, it can prevent the grinding disc 230 from being damaged during the upward and downward movement The wafer, on the other hand, can also prevent the particulate mat...

Embodiment 2

[0040] read on figure 2 and image 3 , a polishing machine platform provided in this embodiment includes a polishing pad 210 , a polishing pad finisher, a polishing head 220 and a polishing liquid supply pipeline 250 , and the polishing pad finisher is arranged on the polishing pad 210 . The grinding pad finisher includes a grinding disc 230 and a driving shaft 240 , the driving shaft 240 is fixedly connected with the grinding disc 230 , and the driving shaft 240 drives the grinding disc 230 to rotate.

[0041] Preferably, the grinder table further includes at least one pair of cleaning tools 260, an up and down driving part 270 and an opening and closing driving part 280, the up and down driving parts 270 are mounted on the drive shaft 240, and the cleaning tools 260 are The up and down driving part 270 moves up and down, and the cleaning tool 260 moves inward or outward under the driving part 280 .

[0042] The number of the cleaning tool 260 may be one, or more than two....

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Abstract

The invention discloses a method for arranging a grinding pad. When wafers are ground, a grinding disc is pressed downwards to arrange the grinding pad. After one wafer is ground and before the next wafer is ground, the grinding disc stays on the grinding pad in the mode of zero-pressure. The invention further discloses a grinding pad arranging device applied to the method for arranging the grinding pad. The grinding pad arranging device comprises the grinding disc and a driving shaft. The driving shaft drives the grinding disc to rotate. The invention further discloses a grinder table which comprises the grinding pad and further comprises the grinding pad arranging device. The grinding pad arranging device is arranged on the grinding pad. The grinding disc can stay on the grinding pad in the whole process that the wafers are ground in batches all the time and the grinding disc does not need to return to a cleaning zone, so that repeated upward movement and downward movement of the grinding disc are avoided. On one hand, the wafers are prevented from being bumped by the grinding disc and on the other hand, the wafers are prevented from being polluted by particulate matters due to friction of the grinding disc and other parts.

Description

technical field [0001] The invention relates to the field of chemical mechanical polishing, in particular to a polishing pad finishing method, a polishing pad finishing device and a polishing machine table. Background technique [0002] Generally, the CMP process performed in a semiconductor process workshop refers to a chemical mechanical polishing (CMP) process or a chemical mechanical planarization (CMP) process. The chemical mechanical polishing process is a complicated process. It contacts the surface of the wafer with the grinding surface of the polishing pad, and then flattens the surface of the wafer through the relative movement between the surface of the wafer and the grinding surface. Abrasive equipment, also known as a grinder table or a polisher table, is used to perform chemical mechanical grinding processes. [0003] like figure 1 As shown, the existing grinding machine platform includes a grinding pad 110, a grinding head 120, a grinding pad finisher and a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/017B24B37/00
CPCB24B37/00B24B53/017
Inventor 唐强刘永
Owner SEMICON TECH INNOVATION CENT(BEIJING) CORP
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