Electroluminescent component and packaging method thereof

An electroluminescence element and electroluminescence technology are applied in the fields of organic light-emitting devices, organic light-emitting device manufacturing/processing, electrical components, etc., which can solve problems such as poor packaging, inability to completely cover areas, and difficulty in accurately controlling filling volume, etc., to achieve The effect of preventing air bubbles and precisely controlling the thickness of the film

Inactive Publication Date: 2014-01-22
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is required to choose a suitable packaging filling method. Even so, the filling volume of the packaging is still difficult to control accurately. If it is small, it will not be able to completely cover the area limited by the packaging cofferdam, and if it is too large, it will easily overflow the packaging cofferdam and cause poor packaging.

Method used

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  • Electroluminescent component and packaging method thereof
  • Electroluminescent component and packaging method thereof
  • Electroluminescent component and packaging method thereof

Examples

Experimental program
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Effect test

no. 1 example

[0063] figure 1 A flow chart showing the packaging method of the electroluminescence component of the present invention according to the first embodiment of the present invention. Such as figure 1 As shown, the packaging method of the electroluminescence component of the present invention comprises the following steps:

[0064]Step S101 : providing a cover plate, on which a number of overflow holes are provided to form a line-frame overflow area, and the overflow holes are all semi-permeable holes and distributed along the edge of the cover plate.

[0065] Step S102: Coating transparent encapsulation desiccant and cofferdam filling glue on the cover plate, the encapsulation desiccant is inside the overflow area, and the cofferdam filling glue surrounds the overflow area.

[0066] Step S103: providing a substrate on which at least one electroluminescence element is formed.

[0067] Step S104: Align and press the base plate and the cover plate, so that the encapsulation desic...

no. 2 example

[0081] Figure 9 A cross-sectional view of the electroluminescence component in the present invention is shown according to the second embodiment of the present invention. Such as Figure 9 As shown, the present invention also provides an electroluminescent component, which is made by the packaging method of the above electroluminescent component, and includes a cover plate 4 and a substrate 1, the substrate 1 is provided with an electroluminescent element 5, and the cover plate 4 is provided with an electroluminescent element 5. A number of overflow holes 6 form a line-frame-shaped overflow area. The overflow holes 6 are all semi-permeable holes and are distributed along the edge of the cover plate 4. The cover plate 4 is coated with transparent packaging desiccant 7 and cofferdam filling glue 3 , the packaging desiccant 7 is within the overflow area, and the cofferdam filling glue 3 surrounds the overflow area. The base plate 1 and the cover plate 4 are cured and encapsula...

no. 3 example

[0085] Figure 10 A top view of the cover plate in the present invention is shown according to the third embodiment of the present invention. Such as Figure 10 As shown, a cover plate is provided, the area on the cover plate 4 that does not need to be etched is protected with photoresist, and then 16 overflow holes 6 are etched along a square frame by hydrofluoric acid. Wherein, the diameter of each overflow hole 6 is 0.8 mm, which can prevent the cover plate 4 from being deformed or broken due to the excessively large diameter of the overflow hole 6, and at the same time ensure a certain accommodation space. The shape of the overflow hole can be any one of circle, ellipse, rectangle, triangle, rhombus and crescent. The depth of the overflow hole 6 is 40% of the thickness of the cover plate 4 . The residual hydrofluoric acid on the cover plate 4 is washed away with deionized water, so as to prevent the influence of the residual hydrofluoric acid on subsequent process steps...

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Abstract

The invention provides an electroluminescent component and a packaging method thereof. The packaging method provided by the invention comprises the steps of providing a cover plate, wherein a plurality of overflow holes are formed in the cover plate to form a wire frame-shaped overflow area and the overflow holes are semi-transparent holes and are distributed along the edge of the cover plate; coating transparent drying agent and filling adhesive on the cover plate, wherein the drying agent is in the overflow area and the filling adhesive surrounds the overflow area; providing a substrate, wherein at least one electroluminescent element is formed on the substrate; press-fitting the substrate and the cover plate to enable the drying agent to be evenly distributed between the cover plate and the electroluminescent element, wherein the overflowing drying agent enters the overflow holes; and providing the filling adhesive for solidifying the substrate and the cover plate to form the packaging structure. The electroluminescent component and the packaging method thereof have the advantages that the drying agent in a limited area in a packaging weir can be fully filled, the drying agent does not flow over the packaging weir, the accurate control of the formed film thickness of the drying agent is facilitated and air bubbles are prevented from being produced.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to an electroluminescence component and a packaging method thereof. Background technique [0002] The bank-fill packaging method is an important development trend in AMOLED (Active Matrix Organic Light-Emitting Diode Panel) packaging technology. Since the light emitted by AMOLED has to pass through the packaged liquid desiccant to the outside, and thus be perceived by the human eye, the quality of the film formed by the packaged liquid desiccant is extremely high. The film must have uniform film thickness and complete coverage without leaving gaps. Therefore, it is required to choose a suitable packaging filling method. Even so, the filling volume of the packaging is still difficult to control accurately. If it is too small, it will not be able to completely cover the area limited by the packaging cofferdam, and if it is too large, it will easily overflow the packaging cofferd...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/52
CPCH10K50/8426H10K50/84H10K71/00
Inventor 张斌刘凤
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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