Method for preparing dimer acid type copolymerized polyamide hot melt adhesive

A dimer acid-type copolymerized polyamide and hot-melt adhesive technology, which is applied in the direction of adhesives, etc., can solve the problems of non-renewable raw materials, product toxicity, and high cost, and achieve the effects of stable production, low cost, simple preparation method, and low water absorption.

Active Publication Date: 2014-02-05
ANQING HONGTAI NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, polyamide resins are mainly prepared from petroleum-based raw materials, and there are defects such as serious pollution in the preparation process, non-renewable raw materials, toxic products, and high cost.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] 700 grams of dimer acid (Anqing Hongyu Company, HY004), 15.2 g of adipic acid, and 5.1 g of glacial acetic acid were put into a 2000 ml reactor, and 60.2 g of ethylenediamine, hexamethylenediamine, and 46.1g, heated up to 230°C within 2 hours, then kept the temperature at 160°C, reacted for 3 hours, vacuumed and decompressed for 1 hour, and discharged to obtain the product.

[0016] The performance indicators are as follows: color 6# (Garrard method); acid value 3.5mgKO hours / g; amine value 2.8mgKO hours / g; viscosity 2230 cP / 160℃; softening point (ring and ball method) 115℃.

Embodiment 2

[0018] 700 grams of dimer acid (Anqing Hongyu Company, HY004), 19.7 g of sebacic acid and 6.2 g of propionic acid were put into a 2000 ml reactor. When the temperature of the reactor rises to 150°C, add 43.5g of decanediamine and 68.1g of ethylenediamine dropwise, and raise the temperature to 250°C within 2 hours, then keep the temperature at 200°C, react for 1 hour, and react under vacuum for 1.5 hours. Out of the material, get the product.

[0019] The performance indicators are as follows: color ≤ 6 (Garrard method); acid value 3.1mgKO hours / g; amine value 2.8mgKO hours / g; viscosity 2560 cP / 160℃; softening point (ring and ball method) 113℃.

Embodiment 3

[0021] In a 2000ml high-pressure reactor, 700 grams of dimer acid (Anqing Hongyu Company, HY004), 12.3 g of succinic acid, and 7.4 g of butyric acid were dropped into a 2000 ml high-pressure reactor, and 38.2 g of hexamethylenediamine was added dropwise when the temperature of the reactor rose to 110° C. 56.3 g of diamine and 22.3 g of decanedidiamine were heated to 240° C. within 2 hours, then kept at 240° C., reacted for 1.5 hours, vacuumed and depressurized for 2.5 hours, and discharged to obtain the product.

[0022] The performance indicators are as follows: color ≤ 6 (Garrard method); acid value 3.1mgKO hours / g; amine value 2.8mgKO hours / g; viscosity 2350 cP / 160℃; softening point (ring and ball method) 111℃.

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Abstract

The invention discloses a method for preparing a dimer acid type copolymerized polyamide hot melt adhesive. The dimer acid type copolymerized polyamide hot melt adhesive is generated by using dimer acid, binary acid and diamine as raw materials and adding a molecular regulator through condensation polymerization, and the method comprises the following steps: putting 1 part by weight of dimer acid, 0.01-0.03 part by weight of binary acid and 0.005-0.012 part by weight of molecular weight regulator into a reactor; dropwise adding 0.05-0.1 part by weight of ethylenediamine and 0.05-0.09 part by weight of diamine into the reactor when the temperature rises to 90-150 DEG C; increasing the temperature to 230-250 DEG C in two hours, keeping the temperature to be 160-260 DEG C, and reacting for 1-5 hours; vacuumizing and decompressing to react for 1-2.5 hours, lowering the pressure in the reactor to normal pressure, and discharging, wherein the molecular weight regulator is one or more of glacial acetic acid, propionic acid, butyric acid and isobutyric acid. The dimer acid type copolymerized polyamide hot melt adhesive prepared by the method can be widely applied to shoe-making or electronic industry, and has the characteristics of high temperature resistance, small water absorption and environment friendliness; the preparation method is simple, the production is stable, the cost is low, and the raw material resource can be regenerated.

Description

technical field [0001] The invention belongs to the field of synthesizing bio-based resin materials by oleochemical method in non-edible oil chemistry, in particular to a preparation method of dimer acid type copolymerized polyamide hot melt adhesive. Background technique [0002] Polyamide resin, commonly known as nylon (Nylon), English name Polyamide (referred to as PA), is the general term for polymers containing amide groups in the repeating unit of the macromolecular main chain. Including aliphatic PA, aliphatic-aromatic PA and aromatic PA, among which aliphatic PA has many varieties, large output and wide application. Polyamide resin contains hydrophilic amide groups and has the following characteristics: 1. Excellent mechanical properties, high mechanical strength and good toughness; 2. Good heat resistance; 3. Good abrasion resistance; 4. Excellent electrical insulation; 5. High water absorption. Polyamide resin is a chemical raw material with excellent performance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/08C09J177/06C08G69/34C08G69/26
Inventor 王文耕王学峰
Owner ANQING HONGTAI NEW MATERIAL
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