A kind of alkaline electroless copper plating compound additive and its preparation method and use method

Abstract

The present invention discloses an alkaline chemical copper plating composite additive, a preparation method and a use method thereof. According to the alkaline chemical copper plating composite additive, 1 L of water contains: 0.2-1.2 ml of an additive 1, 0.1-0.8 g of an additive 2, 0.05-0.3 g of an additive 3, and 0-30 g of sodium hydroxide, wherein the additive 1 is polyoxyethylene castor oil, the additive 2 is 2-mercaptonicotinic acid, and the additive 3 is 2,2'-biquinoline-4,4'-dicarboxylic acid disodium salt or 8-ethoxyquinoline-5-sulfonic acid sodium salt or a mixture of 2,2'-biquinoline-4,4'-dicarboxylic acid disodium salt and 8-ethoxyquinoline-5-sulfonic acid sodium salt. The alkaline chemical copper plating composite additive has excellent dispersibility, leveling capability and deep plating capability in an alkaline environment, can be provided for well solving problems of hydrogen embrittlement production, stripe production, poor color, poor toughness and the like during a copper plating process, has characteristics of economy, practicality and significant effect, and can be provided for well increasing quality of chemical copper plating solutions and quality of plated copper.

Description

technical field [0001] The invention relates to the technical field of electroless copper plating, in particular to an alkaline electroless copper plating composite additive used in electroless copper plating, and also to a preparation method and a use method of the alkaline electroless copper plating composite additive. Background technique [0002] In the process of electroless copper plating, especially in the process of "additive method" electroless copper plating of soft board and plastic substrate surface, there are often bubbles in the plating layer, surface stripes or black spots, and copper plating ability in small holes. Weakness and poor toughness of copper plating lead to a high rate of defective products, which has a very negative impact on the production of enterprises. When the chemical basic copper plating solution is determined, the quality of the copper plating layer depends largely on the selection of additives. Although the theory, technology and rel...

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problems existing in the prior art, to provide a kind of alkaline electroless copper plating composite additive used when carrying out alkaline electroless copper plating, utilize this basic chemical copper plating composite additive to be able to be used in alkaline electroless copper plating It can improve the quality of the copper plating layer at the same time, and can well solve the inclusion of bubbles and cavities (hydrogen embrittlement) in the plating layer, surface streaks or pits, weak copper plating ability in small holes and poor copper plating toughness in the alkaline electroless copper plating process. And other issues

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