High-temperature-baking resistant and water-based paint
A water-based coating, high-temperature technology, applied in epoxy resin coatings, polyurea/polyurethane coatings, chloroprene homopolymer coatings, etc., can solve the problem of slow volatilization process, drying speed dependent on environmental humidity, and large differences in drying environment And other issues
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[0041] The present invention does not specifically limit the preparation method of the high-temperature bakeable water-based paint, and the method for preparing the composition well known to those skilled in the art may be used. In the present invention, the preparation of the high-temperature bakeable water-based paint preferably includes the following steps: combining quick-drying emulsion, common filler, thermally conductive filler, porous filler, anti-cracking fiber, dispersant, wetting agent, anti-settling agent, color The slurry is mixed with water to obtain a high-temperature bakeable water-based paint.
[0042] In the present invention, it is preferable to mix the quick-drying emulsion with dispersant, wetting agent, anti-settling agent and color paste to obtain a mixture; then, the mixture is mixed with ordinary fillers, thermally conductive fillers and porous fillers to obtain a slurry; The slurry is mixed with water to obtain a high-temperature bakeable water-based pai...
Example Embodiment
[0091] Example 1:
[0092] The raw materials include the following components in mass content: quick-drying emulsion 40% (solid content 42%), filler 45%, porous filler 10%, polypropylene fiber 0.3%, dispersant 2.4%, wetting agent 0.3%, anti-settling Agent 1.0%, pigment 0.5%, thickener 0.25%, defoamer 0.25%, water 0%;
[0093] among them,
[0094] Quick-drying emulsion: 20g of styrene-butadiene emulsion with Tg of 20°C, 10g of water-based epoxy resin, and 10g of water-based polyurethane resin;
[0095] Ordinary filler: 35g talc powder with a particle size of 325 mesh, 10g mica powder with a particle size of 400 mesh;
[0096] Porous filler: 5g of zeolite powder with a porosity of 30%, a particle size of 200 mesh, a porosity of 45%, and a molecular sieve of 200 mesh 5g;
[0097] Thermal conductive filler: 15g silicon carbide,
[0098] Polypropylene fiber 0.3g, length 3mm;
[0099] Dispersant Tego 760W 2.5g;
[0100] Wetting agent Tego 245 0.3g;
[0101] Anti-settling agent BYK420 1.0g;
[0102...
Example Embodiment
[0108] Example 2:
[0109] The raw materials include the following components by mass: quick-drying emulsion 35% (solid content 45%), ordinary filler 28.7%, thermal conductive filler 15%, porous filler 15%, polyacrylonitrile fiber 0.3%, dispersant 3%, wetting 1.0% anti-settling agent, 0.5% pigment, 0.35% thickener, 0.35% defoamer, 0% water;
[0110] among them,
[0111] Quick-drying emulsion: T g 15g tertiary vinegar emulsion at 20℃, T g 10g of polyvinyl acetate emulsion at 50℃, T g 10g of chlorine partial emulsion at -10°C;
[0112] Filler: 18.7g calcium carbonate with a particle size of 325 mesh, 10g mica powder with a particle size of 100 mesh;
[0113] Thermal conductive filler: 15g thermal conductive graphite with a particle size of 400 mesh;
[0114] Polyacrylonitrile fiber 0.3g, length 3mm;
[0115] Porous filler: 15g of diatomaceous earth with a porosity of 40% and a particle size of 400 mesh;
[0116] Dispersant Tego 750W 3g;
[0117] Wetting agent air chemistry 104DPM 1.0g;
[011...
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