Automatic thermal conductivity coefficient measurement equipment based on thermoelectric semiconductor

A technology of thermoelectric semiconductor and thermal conductivity, applied in the direction of thermal development of materials, etc., can solve problems such as inaccurate results

Active Publication Date: 2014-02-05
STATE GRID CORP OF CHINA +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, in the prior art, multi-point temperature measurement is used to determine the heat passing through the material.

Method used

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  • Automatic thermal conductivity coefficient measurement equipment based on thermoelectric semiconductor
  • Automatic thermal conductivity coefficient measurement equipment based on thermoelectric semiconductor
  • Automatic thermal conductivity coefficient measurement equipment based on thermoelectric semiconductor

Examples

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Example Embodiment

[0055] figure 1 It is a schematic diagram of a sample tube of a thermal conductivity measurement device according to an embodiment of the present invention. Such as figure 1 As shown, the sample tube used for accommodating the sample 4 includes: an insulating sleeve 1, a heating device 2, a first temperature sensor 3, a second temperature sensor 5, and a pyroelectric semiconductor 6. Optionally, the sample tube may also include a heat dissipation block 7.

[0056] Such as figure 1 As shown, the thermal insulation jacket 1 constitutes a barrel-shaped structure with one end closed, such as a barrel shape or a square barrel shape, for accommodating the heating device 2, the first temperature sensor 3, the sample 4, the second temperature sensor 5, and the thermoelectric semiconductor 6. One end of the thermal insulation sleeve 1 is open and the other end is closed. The openings and closures mentioned here are for heat conduction, and closure refers to thermal closure, that is, the ...

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PUM

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Abstract

The invention provides thermal conductivity coefficient measurement equipment based on a thermoelectric semiconductor. The thermal conductivity coefficient measurement equipment comprises a sample tube, a sample tube support and a controller, wherein the sample tube comprises a heat insulation sleeve, a heating device, a first temperature sensor, a second temperature sensor, the thermoelectric semiconductor and a potential measurement device; the heat insulation sleeve is made of a heat insulation material and is of a hollow cylindrical structure; one end of the heat insulation sleeve is closed, and the other end of the heat insulation sleeve is opened; the heat insulation sleeve is fixed on the sample tube support and is used for accommodating the heating device, a sample and the thermoelectric semiconductor. According to the equipment, the thermoelectric semiconductor is adopted for measuring heat passing through the sample, a temperature stabilizing process is automatically controlled through proportion integration differentiation (PID), errors caused by multi-point temperature measurement are reduced, the temperature stabilizing process is accelerated, and thermal conductivity coefficients of a material at different temperatures can be measured.

Description

technical field [0001] The invention relates to the field of measuring thermal conductivity of materials, in particular to a device for automatically measuring thermal conductivity of materials by using a thermoelectric semiconductor and a PID control system. Background technique [0002] The thermal conductivity of materials is an important characteristic of materials and plays an important role in engineering design. Its application fields are quite extensive, and it is indispensable in petroleum, chemical industry, material and military industry. [0003] At present, there are two methods for measuring the thermal conductivity of materials: steady-state method and unsteady-state method. Measurements based on the steady-state method include the heat flow meter method and the guarded hot plate method. Non-steady-state measurements include hot wire method, tropical method and constant power heat source method. [0004] The steady-state method means that the heat flux thro...

Claims

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Application Information

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IPC IPC(8): G01N25/20
Inventor 黄耀雄王启银王晓强赵锐郭鹏飞王旭李增强党世昉
Owner STATE GRID CORP OF CHINA
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